1
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DMALTYOA64168
|
ROLLERA.,MAIN[S/N:9NL-A00-1U00](PART NUMBER:X570LA07C00A)HS CODE:8486.90BOX,MR[S/N:9NL-A00-3A90](PART NUMBER:X570LA02C001)HS CODE:4415.10
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GLOBALWAFERS AMERICA CO., LTD.
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MEMC JAPAN LTD
|
2025-02-06
|
Japan
|
270 Kgs
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1 CAS
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2
|
FTNVTYS000003861
|
S05QXB1ES0I100199 300MM DONOR FALLOUTTHS CODE381800
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RAMCO TECHNOLOGY, INC.
|
MEMC JAPAN
|
2025-01-13
|
Japan
|
1350 Kgs
|
120 BOX
|
3
|
NNRG17610046603
|
300MM EPI PP+ 1-0-0 0.005-0.010 SILICON EPI WAFERS, DOPED FOR USE IN ELECTRONICS INDUSTRY
|
WAFERNET, INC.
|
MEMC JAPAN LTD.
|
2024-10-03
|
Japan
|
1380 Kgs
|
120 CTN
|
4
|
NNRG17610045093
|
300MM EPI PP+ 1-0-0 0.005-0.010 SILICON EPI WAFERS, DOPED FOR USE IN ELECTRONICS INDUSTRY
|
WAFERNET, INC.
|
MEMC JAPAN LTD.
|
2024-08-24
|
Japan
|
1370 Kgs
|
120 CTN
|
5
|
EXDO6930203572
|
SILICON WAFER CONTAINER HTS: 392310
|
MEMC CORPORATION
|
MEMC JAPAN LTD.
|
2024-06-02
|
Japan
|
408 Kgs
|
48 CTN
|
6
|
NNRG17610042067
|
SILICON EPI WAFERS
|
WAFERNET, INC.
|
MEMC JAPAN LTD.
|
2024-05-07
|
Japan
|
1400 Kgs
|
120 BOX
|
7
|
NNRG17610040867
|
SILICON EPI WAFERS
|
WAFERNET, INC.
|
MEMC JAPAN LTD.
|
2024-04-13
|
Japan
|
1390 Kgs
|
120 BOX
|
8
|
NNRG17610036763
|
300MM EPI PP+ 1-0-0 0.005-0.010
|
WAFERNET, INC.
|
MEMC JAPAN LTD.
|
2023-11-25
|
Japan
|
2780 Kgs
|
240 BOX
|
9
|
FTNVTYS000003241
|
SILICON POLISHED WAFERSSILICON EPI WAFERSDOPED FOR USE IN ELECTRONICS INDUSTRYHSCODE 381800
|
RAMCO TECHNOLOGY, INC.
|
MEMC JAPAN
|
2023-08-18
|
Japan
|
1350 Kgs
|
120 BOX
|
10
|
NNRG17610033366
|
300MM EPI PP+ 1-0-0 0.005-0.010 SILICON EPI WAFERS, DOPED FOR USE IN ELECTRONICS INDUSTRY . . . .
|
WAFERNET, INC.
|
MEMC JAPAN LTD.
|
2023-08-08
|
Japan
|
2502 Kgs
|
216 BOX
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