1
|
FTNVMLS000018767
|
LOADED INTO 1 PLT SILICON WAFERS ELECTRONIC MATERIAL HT CODE 38180010
|
RAMCO TECHNOLOGY INC
|
MEMC ELECTRONIC MATERIALS SPA
|
2025-06-06
|
Italy
|
206 Kgs
|
24 PCS
|
2
|
FTNVMLS000018641
|
SILICON WAFERS ELECTRONIC MATERIAL HT CODE 38180010
|
RAMCO TECHNOLOGY INC
|
MEMC ELECTRONIC MATERIALS SPA
|
2025-04-17
|
Italy
|
322 Kgs
|
2 PCS
|
3
|
FTNVMLS000018531
|
SILICON WAFERS ELECTRONIC MATERIAL HT CODE 38180010
|
RAMCO TECHNOLOGY INC
|
MEMC ELECTRONIC MATERIALS SPA
|
2025-02-10
|
Italy
|
322 Kgs
|
2 PCS
|
4
|
FTNVTYS000003861
|
S05QXB1ES0I100199 300MM DONOR FALLOUTTHS CODE381800
|
RAMCO TECHNOLOGY INC
|
MEMC JAPAN LTD.
|
2025-01-13
|
Japan
|
1350 Kgs
|
120 BOX
|
5
|
FTNVMLS000017558
|
SILICON WAFERS ELECTRONIC MATERIAL HT CODE 38180010
|
RAMCO TECHNOLOGY INC
|
MEMC ELECTRONIC MATERIALS SPA
|
2024-01-16
|
Italy
|
413 Kgs
|
2 PCS
|
6
|
CSWAOAKCA00053
|
SILICON EPI WAFERS
|
RAMCO TECHNOLOGY INC
|
MEMC ELECTRONIC MATERIALS SPA
|
2023-11-11
|
Italy
|
412 Kgs
|
2 PKG
|
7
|
FTNVSTPES0000340
|
12PP WAFER (FRONT/BACK)4 PLT= 48 CTNS
|
RAMCO TECHNOLOGY INC
|
JIA-PIN PACKAGE DESIGN CO., LTD.
|
2023-10-17
|
China Taiwan
|
390 Kgs
|
48 CTN
|
8
|
FTNVTYS000003241
|
SILICON POLISHED WAFERSSILICON EPI WAFERSDOPED FOR USE IN ELECTRONICS INDUSTRYHSCODE 381800
|
RAMCO TECHNOLOGY INC
|
MEMC JAPAN LTD.
|
2023-08-18
|
Japan
|
1350 Kgs
|
120 BOX
|
9
|
CSWAOAKCA00041
|
SILICON EPI WAFERS DOPED
|
RAMCO TECHNOLOGY INC
|
MEMC ELECTRONIC MATERIALS SPA
|
2023-06-18
|
Italy
|
412 Kgs
|
2 PKG
|
10
|
FTNVTYS000003133
|
SILICON POLISHED WAFERSDOPED FOR USE IN ELECTRONICS INDUSTRYHS CODE 381800
|
RAMCO TECHNOLOGY INC
|
MEMC JAPAN LTD.
|
2023-05-16
|
Japan
|
1215 Kgs
|
108 CTN
|