Hp Inc. C/o Inventec (Chongqing)

Name: Hp Inc. C/o Inventec (Chongqing) | See Recent Shipments | ImportGenius
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US Customs records for Hp Inc. C/o Inventec (Chongqing), a supplier based in China. See their past imports and exports, including shipments to Iec Techologies, S. De R.L. De C.V. in Juarez, Ch.

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Total Shipments

2,298

Trading Partners

Top Partner

IEC TECHOLOGIES, S. DE R.L. DE C.V.

Ports

Top Port

Los Angeles, California

Contact Info

Hp Inc. C/o Inventec (Chongqing)

Ltd. No. 66 West District 2nd Rd Shapingba District, Chongqing 401331 China

Hp Inc. C/o Inventec (Chongqing) Records

Get a complete supplier history

Updated: 2025-12-20

Total shipments from 2006-11-01 to 2025-12-21

Precise data and chart data points are only available to paid subscribers

Supplier Shipments

Top Trading Partners

Legend

Top Ports

Legend

Los Angeles, California
Long Beach, California
Miami, Florida
Savannah, Georgia
New York/Newark Area, Newark, New Jersey

Total shipments from 2006-11-01 to 2025-12-21

Precise data and chart data points are only available to paid subscribers

Supplier Shipments

#	Bill of Lading	Product	Importer	Supplier	Arrival Date	Country of Origin	Gross Weight KGS	Quantity
1	CMDUSHZ7721620	SET,HOUSING,BOTTOM SET,BEZEL,DISPLAY,NON TOUCH,ACS, IC,AND GATE, . . V,SINGLE INPUT,SOT DIODE,ESD, V,SMD,WLCSP . X . - ,TR CONNECTOR,HDMI . +RJ ,COMBO, . / . DIODE,ESD, V,SMD,WLCSP . X . - ,TR TRANSISTOR-FET,NEMOS, V, A,DFN X , P,, CAPACITOR-CHIP, . UF, V,K,X R, ,TR, TRANSISTOR-FET,NEMOS, V, . A,LGA, P,TR TRANSISTOR-FET,NEMOS, V, . A,SMD, P,TR IC,TEMPERATURE SENSOR,QFN, P,TR IC,MOSFET DRIVER,+ + . V, A,FC-LGA- , IC,HUB CONTROLLER, . . V,USB . GEN P IC,PCI-E CARD READER CONTROLLER, . . V IC,PWM CONTROLLER, . . V, KHZ- MHZCONNECTOR,USB . , . / . MM,BLK, P, D, CONNECTOR,HDMI, . / . MM,BLK, P, D,DI CONNECTOR,DISPLAY PORT,DUAL, . / . / TRANSISTOR-FET,NMOSFET, V, A,PDFN X P DIODE,ESD, V,SMD,WLCSP . X . - ,TR DIODE,ESD, . V, MA,SMD,DFN P E,TR CAPACITOR-CHIP, . UF, . V,M,X R, ,TR, IC,DRIVER MOSFET, A,TQFN- , P,TRTRANSFORMER, / / G/ . G,SMD, P, . X TRANSISTOR-FET,NEMOS, V, A,PDFN X P, TRANSISTOR-FET,NEMOS, V, A,PDFN X P, TRANSISTOR-FET,NMOSFET, V, A,DFN , P CAPACITOR-CHIP, UF, V,M,X S, ,TR, . CAPACITOR-CHIP, UF, . V,M,X S, ,TR, DIODE-LED,RED/GRN/BLU, . X . , - / CAPACITOR-CHIP, . UF, V,K,X R, ,TR,IC,LOAD SWITCH,TDFN- X - , P,TR DIODE,SWCH, V, MA, MW,SMD,SOT- ,T DIODE,SCH, V, MA, MW, NS,SMD,SOT- TRANSISTOR,DUAL PNP,- V,- MA,SOT , CAPACITOR-AL-SP, UF, V,M,- + C,DX CAPACITOR-AL-SP, UF, V,M,- + C,DX CAPACITOR-AL-SP, UF, . V,M,- + C,D CONNECTOR,W TO B, . MM,ML,BLK, X , . MM,CAPACITOR-AL-SP, UF, . V,- /+ ,- CONNECTOR,FPC,BACK FLIP, . / . MM,FL,N CAPACITOR-CHIP, UF, V,M,X R, ,TR, . CAPACITOR-OS, UF, . V,M, C, . X . ,L BEAD, OHM, , MA, . OHM, INCH, CAPACITOR-CHIP, . UF, . V,M,X R, ,TR, ASSEMBLY,MODULE,CASE REAR,DISPLAY,WLAN, LATCH,BOTTOM COVER,POMHOLDER,BOTTOM IO,RIGHT,PC+ABS+ TALC, HOLDER,DISPLAY HINGE,PC+ABS, SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS COVER,DISPLAY HINGE,LEFT,RAL ,WWAN, COVER,DISPLAY HINGE,RIGHT,RAL ,WWAN, COVER,DISPLAY HINGE,RIGHT,RAL ,WLAN, FAN,BLOWER, MM, . CFM, . PA, V,COVER,CABLE,PC+ABS+ TALC BUTTON,BOTTOM COVER,PC+ABS+ TALC BUTTON,BOTTOM COVER,PC+ABS+ TALC COVER,CABLE,PC+ABS TALC ASSEMBLY,HOLDER,PCB ASSEMBLY,HOLDER,PCB ASSEMBLY,HOLDER,PCB ASSEMBLY,HOLDER,PCBPART NO: H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H PO :INV: H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H HH H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LISTTO REGION FOR DESTINATION ARRANGEMENT. NOTIFY : HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2025-12-20	China	10093 Kgs	661 CTN
2	CMDUSHZ7721622	TAPE,ADHESIVE, MM, MM, . MM, M T,W GASKET,DISPLAY,RF,NI/CU PPW GASKET,GPU,SHIELDING,CF GASKET,LZF, MM, MM, . MM,CONDUCTIVE ADH BUMPER,DC,LED,SILICON RUBBER BUMPER,TOP,POWER REAR,SILICONE RUBBER, BUMPER,TOP,POWER,SILICONE RUBBER,, INSULATOR,THERMAL,HE GPU,DFR PAD,THERMAL,TP,GRAPHITE,K= W/MK, GASKET,GPU SHIELD,LZF/CF/MF ,UP, GASKET,GPU MR,LZF/CF/MF ,DOWN, GASKET,GPU HE,LZF/CF/MF ,DOWN, GASKET,LZF/CF/MF , MM, MM, . MM, PAD, MM, MM, MM,FSL-BSNA PAD, MM, MM, . MM,FSL-BSNAPAD, MM, MM, . MM,FSL-BSNA GASKET,DISPLAY, ACS,MYLAR GASKET,TOP,THPAD,CU+TT , GASKET,BXYZ-D, MM, MM, . MM GASKET,LZF/CF/MF , MM, MM, . MM GASKET,BXYZ-D, MM, MM, MM GASKET,GPU MR,BXYZ-D,UP GASKET,CF, . MM, MM, MMFOAM,DISPLAY CAMERA,THIN,JS-LOC-B , HINGE-W BRACKET,DISPLAY,LEFT, . . KGF- HINGE-W BRACKET,DISPLAY,RIGHT, . . KGF FFC,NFC, P, X X . MM, . / . MM,PET,G/F GASKET,BTY,CONDUCT FABRIC GASKET,BXYZ-D, MM, MM, . MM GASKET,BXYZ-D, MM, MM, MM GASKET,NI/CU PPW FR, . MM, MM, . MM,AUTGASKET,NI/CU PPW FR, MM, MM, . MM,AUTO INSULATOR,DISPLAY HINGE,DFR- ,ADHESIVE PAD,THERMAL,KB,GRAPHITE,K= W/MK, INSULATOR, MM, MM, . MM,PC FPC,LAN, L, X . X . MM, . / . MM,RA,D, FOAM,P , MM, MM, . MM,THIN FFC,SMART CARD, P, . X . X . MM, . / MODULE,FINGER PRINT,SOFT GREYHINGE-W BRACKET,DISPLAY,LEFT, . . KGF- HINGE-W BRACKET,DISPLAY,RIGHT, . . KGF FAN,BLOWER, MM, . CFM, . PA, V, BRACKET,RJ ,SGCC ASSEMBLY,HOLDER,PCB ASSEMBLY,HOLDER,PCB ASSEMBLY,HOLDER,PCB ASSEMBLY,HOLDER,PCBASSEMBLY,HOLDER,PCB ASSEMBLY,HOLDER,PCB ASSEMBLY,HOLDER,PCB ASSEMBLY,HOLDER,PCB ASSEMBLY,HOLDER,PCB ASSEMBLY,CASE,BOTTOM,W/O,RJ , N PART NO: H H H H HH H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H HPO : INV: H H H HH H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H HH H H H H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BBTO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY : HP INC. PAGE MILL ROAD SANTA CLARA PALOALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2025-12-20	China	10977 Kgs	766 CTN
3	CMDUSHZ7721586	ASSEMBLY,CASE,BOTTOM,W/O,RJ , N ASSEMBLY,CASE,BOTTOM,W/O,RJ , N ASSEMBLY,TOP,THICK,KEYBOARD,SUB,AI+ NON ASSEMBLY,TOP,THICK,KEYBOARD,SUB,AI+ NON ASSEMBLY,CASE,BOTTOM,W/O,RJ , N ASSEMBLY,CASE,BOTTOM,W/O,RJ , N ASSEMBLY,CASE,BOTTOM,W/O,RJ , N, PART NO: H H H H H H H PO :INV: H H H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USABY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2025-12-20	China	6302 Kgs	496 CTN
4	CMDUSHZ7721619	SET,BEZEL,DISPLAY,IR, W ASSEMBLY,CASE,BOTTOM,W/O,RJ , N ASSEMBLY,CASE,BOTTOM,W/O,RJ , N ASSEMBLY,CASE,BOTTOM,W/O,RJ , N PART NO: H H H H, PO : INV: H H H H HS CODE: CARTONS INTO PALLETSHPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATIONARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2025-12-20	China	5470 Kgs	557 CTN
5	CMDUSHZ7611917	SET,COVER,TOP,PCR ASSEMBLY,CASE,BOTTOM,RJ THICK, W ASSEMBLY,CASE,BOTTOM,NRJ THIN- , TRANSISTOR-FET,NMOSFET, V, A,DFN , P PART NO:H H H H PO :, INV: H H H H HS CODE: CARTONS INTO PALLETS ( PALLETS + CARTONS) HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USABY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2025-11-16	China	6513 Kgs	471 CTN
6	CMDUSHZ7611916	SET,COVER,TOP,PCR PART NO:H PO : INV: H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS, ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT.NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2025-11-16	China	6443 Kgs	420 CTN
7	CMDUSHZ7591148	SET,DISPLAY,BEZEL,IR, SET,COVER,A,BLACK SET,POGO,RING,BLACK SET,COVER,A,BLACK SET,BUTTON,VOLUME,BLACK SET,VOLUME,BUTTON SET,AC RING,MALTA, SET,CASE,BEZEL,DISPLAY,METEOR SET,DISPLAY,BEZEL,NON AG, X IC,FLASH MEMORY, M,- + C, . . V, RESISTOR-CHIP, K, , / W, . A, ,TR SET,HOLDER,A SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , MM,MACH, . MM, . MM,CROSS,SCREW,I,M . , MM,MACH, . MM, . MM,CROSS, INSULATOR, MM, MM, . MM, D SHIELD,TOP,ABSORBER,DST- , ,MYLAR INSULATOR,PCB,L SHAPE,PC, . T, W FOAM,LED PCB,CR- , . MM COVER,TOP,POWER,PCFR E+TIO , X SET,HOUSING,BOTTOM SET,HOUSING,BOTTOMASSEMBLY,MODULE,REAR,DISPLAY,WWAN, P,IM PART NO: H H H H H H H H H H H H H H H H H H H H H H H H PO : INV: H H H HH H H H H H H H H H H H H H H H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LISTTO REGION FOR DESTINATION ARRANGEMENT. NOTIFY : HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2025-10-25	China	9844 Kgs	650 CTN
8	CMDUSHZ7594033	DIODE,ESD, . V, A,SMD,CSP P Y,TR IC,POWER SWITCH,SOT - , P,TR DIODE,ESD, . V, MA,SMD,DFN P E,TR IC,REDRIVER,DE MUX,WQFN, P,TR IC,CONTROLLER, . V,WLCSP, P,TR IC,BUCK-BOOST CONTROLLER, . V,VQFN,, CAPACITOR-CHIP, UF, V, M,X R, ,TR CAPACITOR-CHIP, UF, V, M,X R, ,TR, . INDUCTOR, . UH, , MHZ, MA, . X X . CAPACITOR-CHIP, UF, V, M,X R, ,TR, .CAPACITOR-AL, UF, V,M, C, . X , / CAPACITOR-CHIP, UF, V,K,X R, ,TR IC,USB TYPE-C PORT CONTROLLER,QFN, P,TR IC,USB CONTROLLER HUB, -PORT, USB . ,QFN, SET,HOLDER,A ASSEMBLY,CASE,TOP,NRJ, PART NO:H HH H H H H H H H H H H H H H H H H PO : INV:H H H H H H H HH H H H H H H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LISTTO REGION FOR DESTINATION ARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2025-10-25	China	13254 Kgs	653 CTN
9	CMDUSHZ7461581	ASSEMBLY,TOP,THICK,KEYBOARD, SUB,AI+ NON ASSEMBLY,TOP,THICK RJ , KEYBOARD,SUB,PCB ASSEMBLY,MODULE,REAR,DISPLAY, WLAN PCB , PART NO:H H, H H H H PO : INV:H H H H HH HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BBTO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATESAMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2025-09-04	China	6462 Kgs	486 CTN
10	CMDUSHZ7461583	ASSEMBLY,CASE,BOTTOM,SUB, NRJ THIN, N ASSEMBLY,CASE,BOTTOM,SUB, NRJ THIN, N ASSEMBLY,MODULE,REAR,DISPLAY, WLAN, P,IM ASSEMBLY,MODULE,REAR,DISPLAY,, WLAN, P,IM ASSEMBLY,MODULE,REAR,DISPLAY, WLAN, P,IM PART NO:H H H H H PO : INV:H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USABY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2025-09-04	China	7595 Kgs	488 CTN

#	Importer	Last Address	Most Recent	No. of Containers	Gross Weight KGS
1	IEC TECHOLOGIES, S. DE R.L. DE C.V.	Los Angeles, California	2025-12-20	1077	5359938 Kgs
2	HP INC. C/O XPOLOGISTICS	Los Angeles, California	2024-01-14	800	6746123 Kgs
3	IEC TECHOLOGIES, S. DE R.L. DE C.	Long Beach, California	2025-07-06	248	865193 Kgs
4	HP INC.C/O RYDER LOGISTICS	Los Angeles, California	2018-12-08	58	569469 Kgs
5	HP INC. C/O RYDER LOGISTICS INDY	Long Beach, California	2024-01-14	25	235019 Kgs

#	Supplier	Last Address	Most Recent

More data available to paid subscribers

Sample Shipment From Hp Inc. C/o Inventec (Chongqing)

Bill of Lading CMDUSHZ7721620

Arrival Date: 2025-12-20

Container Number: TCNU3784302

Cargo #1
Description SET,HOUSING,BOTTOM SET,BEZEL,DISPLAY,NON TOUCH,ACS, IC,AND GATE, . . V,SINGLE INPUT,SOT DIODE,ESD, V,SMD,WLCSP . X . - ,TR CONNECTOR,HDMI . +RJ ,COMBO, . / . DIODE,ESD, V,SMD,WLCSP . X . - ,TR TRANSISTOR-FET,NEMOS, V, A,DFN X , P, CAPACITOR-CHIP, . UF, V,K,X R, ,TR, TRANSISTOR-FET,NEMOS, V, . A,LGA, P,TR TRANSISTOR-FET,NEMOS, V, . A,SMD, P,TR IC,TEMPERATURE SENSOR,QFN, P,TR IC,MOSFET DRIVER,+ + . V, A,FC-LGA- , IC,HUB CONTROLLER, . . V,USB . GEN P IC,PCI-E CARD READER CONTROLLER, . . V IC,PWM CONTROLLER, . . V, KHZ- MHZ CONNECTOR,USB . , . / . MM,BLK, P, D, CONNECTOR,HDMI, . / . MM,BLK, P, D,DI CONNECTOR,DISPLAY PORT,DUAL, . / . / TRANSISTOR-FET,NMOSFET, V, A,PDFN X P DIODE,ESD, V,SMD,WLCSP . X . - ,TR DIODE,ESD, . V, MA,SMD,DFN P E,TR CAPACITOR-CHIP, . UF, . V,M,X R, ,TR, IC,DRIVER MOSFET, A,TQFN- , P,TR TRANSFORMER, / / G/ . G,SMD, P, . X TRANSISTOR-FET,NEMOS, V, A,PDFN X P, TRANSISTOR-FET,NEMOS, V, A,PDFN X P, TRANSISTOR-FET,NMOSFET, V, A,DFN , P CAPACITOR-CHIP, UF, V,M,X S, ,TR, . CAPACITOR-CHIP, UF, . V,M,X S, ,TR, DIODE-LED,RED/GRN/BLU, . X . , - / CAPACITOR-CHIP, . UF, V,K,X R, ,TR, IC,LOAD SWITCH,TDFN- X - , P,TR DIODE,SWCH, V, MA, MW,SMD,SOT- ,T DIODE,SCH, V, MA, MW, NS,SMD,SOT- TRANSISTOR,DUAL PNP,- V,- MA,SOT , CAPACITOR-AL-SP, UF, V,M,- + C,DX CAPACITOR-AL-SP, UF, V,M,- + C,DX CAPACITOR-AL-SP, UF, . V,M,- + C,D CONNECTOR,W TO B, . MM,ML,BLK, X , . MM, CAPACITOR-AL-SP, UF, . V,- /+ ,- CONNECTOR,FPC,BACK FLIP, . / . MM,FL,N CAPACITOR-CHIP, UF, V,M,X R, ,TR, . CAPACITOR-OS, UF, . V,M, C, . X . ,L BEAD, OHM, , MA, . OHM, INCH, CAPACITOR-CHIP, . UF, . V,M,X R, ,TR, ASSEMBLY,MODULE,CASE REAR,DISPLAY,WLAN, LATCH,BOTTOM COVER,POM HOLDER,BOTTOM IO,RIGHT,PC+ABS+ TALC, HOLDER,DISPLAY HINGE,PC+ABS, SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS COVER,DISPLAY HINGE,LEFT,RAL ,WWAN, COVER,DISPLAY HINGE,RIGHT,RAL ,WWAN, COVER,DISPLAY HINGE,RIGHT,RAL ,WLAN, FAN,BLOWER, MM, . CFM, . PA, V, COVER,CABLE,PC+ABS+ TALC BUTTON,BOTTOM COVER,PC+ABS+ TALC BUTTON,BOTTOM COVER,PC+ABS+ TALC COVER,CABLE,PC+ABS TALC ASSEMBLY,HOLDER,PCB ASSEMBLY,HOLDER,PCB ASSEMBLY,HOLDER,PCB ASSEMBLY,HOLDER,PCB PART NO: H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H PO : INV: H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY : HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E. IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
Keywords set housing	HS-Code DATA UNAVAILABLE	Piece Count 661

Length 480	Height 108
Width 96	Load Status Loaded
Seal M7963632	Equipment Description CN
Type 40 Foot Dry Container, Opening at one or both end	Type of Service Pier to Pier
Container Type 40 Foot Dry Container, Opening at one or both end	Marks & Numbers N/M

Carrier COMPAGNIE MARITIME D-AFFRETEMENT	Carrier Code CMDU
Carrier Address 5701 LAKE WRIGHT DR	Carrier Contact Number DATA UNAVAILABLE
Ship Registered In DATA UNAVAILABLE	Foreign Port YANTIAN
Voyage Number 0TXLW	Country of Origin CHINA
Vessel Name CMA CGM FORT DIAMANT	U.S. Port DATA UNAVAILABLE
Master Bill of Lading CMDUSHZ7721620	Weight (LB/KG) 22255.065000000002 / 10093
Quantity 661 CTN	Container Count 1
Place of Receipt YANTIAN	Distribution Port DATA UNAVAILABLE
House-v-Master DATA UNAVAILABLE	Measurement DATA UNAVAILABLE
In-Bond Entry-Type DATA UNAVAILABLE	Bill Type Code Regular Bill