Hp Inc. C/o Inventec (Chongqing)

Name: Hp Inc. C/o Inventec (Chongqing) | See Recent Shipments | ImportGenius
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US Customs records for Hp Inc. C/o Inventec (Chongqing), a supplier based in China. See their past imports and exports, including shipments to Iec Techologies, S. De R.L. De C.V. in Juarez, Ch.

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Total Shipments

2,290

Trading Partners

Top Partner

IEC TECHOLOGIES, S. DE R.L. DE C.V.

Ports

Top Port

Los Angeles, California

Contact Info

Hp Inc. C/o Inventec (Chongqing)

Ltd. No. 66 West District 2nd Rd Shapingba District, Chongqing 401331 China

Hp Inc. C/o Inventec (Chongqing) Records

Get a complete supplier history

Updated: 2025-09-04

Total shipments from 2006-11-01 to 2025-09-04

Precise data and chart data points are only available to paid subscribers

Supplier Shipments

Top Trading Partners

Legend

Top Ports

Legend

Los Angeles, California
Long Beach, California
Miami, Florida
Savannah, Georgia
New York/Newark Area, Newark, New Jersey

Total shipments from 2006-11-01 to 2025-09-04

Precise data and chart data points are only available to paid subscribers

Supplier Shipments

#	Bill of Lading	Product	Importer	Supplier	Arrival Date	Country of Origin	Gross Weight KGS	Quantity
1	CMDUSHZ7461581	ASSEMBLY,TOP,THICK,KEYBOARD, SUB,AI+ NON ASSEMBLY,TOP,THICK RJ , KEYBOARD,SUB,PCB ASSEMBLY,MODULE,REAR,DISPLAY, WLAN PCB , PART NO:H H, H H H H PO : INV:H H H H HH HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BBTO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATESAMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2025-09-04	China	6462 Kgs	486 CTN
2	CMDUSHZ7461583	ASSEMBLY,CASE,BOTTOM,SUB, NRJ THIN, N ASSEMBLY,CASE,BOTTOM,SUB, NRJ THIN, N ASSEMBLY,MODULE,REAR,DISPLAY, WLAN, P,IM ASSEMBLY,MODULE,REAR,DISPLAY,, WLAN, P,IM ASSEMBLY,MODULE,REAR,DISPLAY, WLAN, P,IM PART NO:H H H H H PO : INV:H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USABY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2025-09-04	China	7595 Kgs	488 CTN
3	CMDUSHZ7461579	RESISTOR-CHIP, K, , / W, ,TR IC,HUB CONTROLLER,USB . , QFN, P,TR TRANSISTOR-FET,PEMOS, V, MA,SOT , P, DIODE,SCH, V, . A, MW,SMT,, SOT- ,TR BEAD, OHM, , . A, . OHM, INCH, IC,THERMAL SENSOR,ONE, BIT ADC,SOT- , P IC,TEMPERATURE SENSOR, SOT - , P,TR IC,PROTECTION DEVICE,ESD, V,DFN X - L, DIODE-ZNR, . V, . MA, MW,SMD, SOD ,TR TRANSISTOR-FET,PEMOS,- V,- A, DFN X , P DIODE,ESD, V, A, W,SMD, SLP P X F,TR DIODE,ESD, . V, A,SMD,DFN P E,TRDIODE,ESD, . V,SMD,DFN P X,TR IC,ANALOG SWITCH,UQFN, P,TR ASSEMBLY,CASE,BOTTOM,SUB, RJ THICK, W ASSEMBLY,TOP,THICK,KEYBOARD, SUB,AI+ NON PART NO:H H H HH H H H H H H H H H H H H H H PO : INV:H H H H H H H H H HH H H H H H H H H HS CODE: CARTONS INTO PALLETSHPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATIONARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2025-09-04	China	6360 Kgs	508 CTN
4	CMDUCHN2529205	SET,BEZEL,DISPLAY,IR, W SET,BEZEL,DISPLAY, W,IR CABLE,ROUND, POS, MM,E,MDP TO DP ADAP FAN,BLOWER, . X . X . MM, . CFM, . FRAME,TOP,KEYBOARD,PC+ABS+ TALC,US, ASSEMBLY,MODULE,REAR,DISPLAY,WLAN, P,IM ASSEMBLY,CASE,BOTTOM,W/O,RJ , N, PART NO: H H H H H H H H H PO :INV: H H H H H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALSALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT.NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2025-09-04	China	6745 Kgs	22 PKG
5	CMDUCHN2529193	ASSEMBLY,TOP,THICK RJ ,KEYBOARD,SUB,PCB ASSEMBLY,CASE,BOTTOM,W/O,RJ , N FUSE,POLYMER, . A, V,SMD, . X . ,TR STANDOFF,FF,M . , . MM, . MM,RND,SN, . STANDOFF,FF,M . , . MM, . MM,RND,SN, . STANDOFF,FF,M . , . MM, . MM,RND,SN, MM CLIP, . MM, . MM, . MM,SUS / H,H= ., CLIP, . MM, . MM, . MM,SUS / H,H= FRAME,SHIELDING,C ,R SHIELD,CPU INL,KU S, N, SHIELD,CPU INL,KU S, N, CABLE,ROUND, POS, MM,E,TBT COMBO PCB,SMART CARD, L,HALONGFREE,ENTEK PCB,ECOM, L,FR ,ENTEK PART NO:H H H H H H H H H H H H H H H H H PO : INV: H H H H H HH H H H H H H H H H H HS CODE: CARTONS INTO PALLETSHPI-IMX - RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATIONARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2025-09-04	China	6776 Kgs	23 PKG
6	CMDUCHN2529191	SET,BEZEL,DISPLAY,IR, P SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X FUSE,POLYMER, . A, V,SMD, . X . ,TR STANDOFF,FF,M . , . MM, . MM,RND,SN, . CLIP, . MM, . MM, . MM,SUS / H,H= BRACKET,TOP,SMART CARD,KU S,AUTO, TOUCH PAD,NO BUTTON, P, . X ,PIKE SIL SPEAKER.W/HOUSING, OHM, . W, X , . X HINGE-W BRACKET,DISPLAY,LEFT, . . KGF- HINGE-W BRACKET,DISPLAY,RIGHT, . . KGF SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , X . KEYBOARD MODULE, ,USB,JACK BLACK,US, SPEAKER.W/HOUSING, OHM, W, X , . XSPEAKER.W/HOUSING, OHM, W, X , . X SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X .SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X SPEAKER.W/HOUSING, OHM, W, X , . X SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X . THERMAL MODULE,INTEL ARL,UMA, W,CHIPSET SET,TOP,HOUSING SET,FRAME,BTM,MWSSET,BEZEL,DISPLAY,IR, P DUMMY,SMART CARD,TOP,PC+ABS+ TALC, FRAME,TOP,KEYBOARD,PC+ABS+ TALC,UK, HOLDER,BOTTOM IO,RIGHT,PC+ABS+ TALC, HOLDER,TOP,IO R,PC+ABS TALC, P BUTTON,TOP FPR,PC, P FAN,BLOWER, . . . MM, . CFM, . SCREW,I,M . , . MM,MACH, . MM, . MM,CROSSCREW,I,M . , . MM,MACH, . MM,. MM,CROSS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROSSCREW,PAN,M . , . MM,MACH, . MM, . MM,CR SCREW,I,M . , MM,MACH, . MM, . MM,CROSS, SCREW,I,M . , . MM,MACHINE, . MM, . MM, SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS PAD, MM, MM, . MM,DENKA BSNA SHIELD,PCB,MAIN,ABSORBER, GASKET,CF, MM, MM, MM,CONDUCTIVE,ADHESIGASKET,CF, MM, MM, MM,CONDUCTIVE,ADHESI GASKET,CF, MM, MM, MM,CONDUCTIVE,ADHESI CAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP, PF, V,J,C G, ,TR,. CAPACITOR-TA-SP, UF, . V,M,- + C, DIODE,RECT, V, A,SMD,SOD- FL,TR RESISTOR-CHIP, , , / W, ,TRRESISTOR-CHIP, , , / W, ,TR RESISTOR-CHIP, . K, , / W, ,TR RES-CHIP- . K- - / W- -TAP RES-CHIP- K- - / W- -TAP RESISTOR-CHIP, . K, , / W, ,TAP RESISTOR-CHIP, . K, , / W, ,TR RESISTOR-CHIP, . , , / W, ,TR RESISTOR-CHIP, , , / W, ,TRRESISTOR-CHIP, K, , / W, ,TR RESISTOR-CHIP, K, , / W, ,TR RESISTOR-CHIP, K, , / W, ,TR RESISTOR-CHIP, . K, , / W, ,TR RESISTOR-CHIP, , , / W, ,TR RESISTOR-CHIP, K, , / W, . A, ,TR RESISTOR-CHIP, ,+/- , / W, ,TR RESISTOR-CHIP, ,+/- , / W, ,TAPRESISTOR-CHIP, . K,+/- , / W, ,TAP RESISTOR-CHIP, . K,+/- , / W, ,TAP RESISTOR-CHIP, K,+/- , / W, ,TAP RESISTOR-CHIP, ,+/- , / W, ,TR,+/- RESISTOR-CHIP, ,+/- , / W, ,TR,+/ RESISTOR-CHIP, . ,+/- , W, ,TR,+/- RESISTOR-CHIP, . K,+/- , / W, ,TR INDUCTOR, . UH, , KHZ, A, . X XBEAD, OHM, , A, . OHM, INCH, MH BEAD, OHM, , A, . OHM, INCH, M INDUCTOR, . UH,+/- , KHZ, . A, . X . BEAD, OHM, , A, . OHM, INCH, INDUCTOR, . UH,+- , KHZ, A, . X . INDUCTOR, . UH,+- , KHZ, . A, . X . CRYSTAL, MHZ, PPM, PF,SMD, . X . X . CRYSTAL, . KHZ,+/- PPM, . PF,SMD, .CRYSTAL, MHZ,+/- PPM, PF,SMD, . X . X CRYSTAL, . MHZ,+/- PPM, PF,SMD, . X . IC,STEP DOWN CONVERTER, . . V, . MHZ,V IC,FLASH MEMORY, M,- + C, . . V, IC,STEP DOWN CONVERTER, . . V, . MHZ,V IC,TEMPERATURE SENSOR, . . V,VSSOP, P CAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP,. UF, . V,M,X R, ,TRCAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP, . UF, . V,K,X R, ,TR CAPACITOR-CHIP, . PF, V,C,C G, ,TR, CAPACITOR-CHIP, PF, V,J,C G, ,TR, . CAPACITOR-CHIP, . UF, . V,M,X R, ,TR CAPACITOR-CHIP, . UF, V,K,X R, ,TR DIODE,RECT, V, A,SMD,SOD- FL,TR CONNECTOR,W TO B, . / . MM,ML,BLK, X , .BEAD- OHM- - . A- . OHM- INCH- INDUCTOR, . UH,+/- , KHZ, A, . X INDUCTOR, . UH,+/- , KHZ, . A, . X . INDUCTOR, . UH,+- , KHZ, A, . X . INDUCTOR, . UH,+/- , KHZ, A, . X . INDUCTOR, . UH,+- , KHZ, A, X . X INDUCTOR, . UH,+- , MHZ, A, . X . X TRANSISTOR-FET,NEMOS, V, A,DFN X , P,IC,FLASH MEMORY, M,- + C, . . V, CONNECTOR,W TO B, . / . MM,ML,BLK, X , . TRANSISTOR-FET,PEMOS,- V, A,SOT- , P,T IC,ANALOG MUX/DEMUX,X - DFN - , P,TR DIODE,ESD, V,SMD,SOD ,TR CONNECTOR,W TO B, . / . MM,ML,BLK, X , . CONNECTOR,FPC,BACK FLIP, . / . MM,FL,NTU RESISTOR-CHIP, . ,+- , W, ,TRRESISTOR-CHIP, . ,+/- , W, ,TR,+- IC,MICROPOWER HALL SWITCH,TSOT - L, P,T IC,AND GATE, . . V, INPUT,SINGLE,TSSO BEAD, OHM, , MA, . OHM, INCH, IC,TEMPERATURE SENSOR,MSOP, P,TR ASSEMBLY,CASE,BOTTOM,SUB,NRJ THIN- , PART NO: H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H PO : INV: H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HHS CODE: CARTONS INTO PALLETS( PALLETS + CARTONS) HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LISTTO REGION FOR DESTINATION ARRANGEMENT. NOTIFY : HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2025-09-04	China	8350 Kgs	26 PKG
7	CMDUCHN2529218	SCREW,I,M . , . MM,P, . MM, . MM,TORX/SL FRAME,BOTTOM,LNL-SUP,PC+ABS TALC, P FRAME,BOTTOM,LNL,SUP,PC+ABS TALC, ,Z DUMMY,SMART CARD,TOP,PC+ABS, + TALC, W BUTTON,TOP,POWER,PCFR E+TIO , GRAY SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SHIELD,CAN DDR,WLAN, SUS , W THERMAL MODULE,AMD FP , W,CHIPSET DOWN BRACKET,TOP,KEYBOARD,SGCC, LNL MOUSE,USB, B+WHEEL,OPTICAL, BLACK TOUCH PAD,NO BUTTON, P, X . ,PIKE S KEYBOARD, ,BL, P,SOFT GREY,USA, . X KEYBOARD, ,BL, P,BLACK,CAN-FR / MULTI,ASSEMBLY,MODULE,REAR,DISPLAY,WLAN, P,IM ASSEMBLY,MODULE,REAR,DISPLAY,WLAN, P,IM ASSEMBLY,MODULE,REAR,DISPLAY,WLAN, P,IM TRANSISTOR-FET,NNEMOS, V, / A,DFN, P, CAPACITOR-CHIP, UF, . V,M,X R, ,TR, CAPACITOR-TA-SP, UF, V,M, C,BX . ,SM IC,PWM CONTROLLER, . - . V, KHZ- MHZ,T IC,REPEATER/LEVEL SHIFTER, . GBPS,HDMI,IC,PROTECTION DEVICE, V,FLAT-CLAMP SURG IC,LOAD SWITCH, . . V, A,DSBGA, P,TR IC,TEMPERATURE SENSOR, . . V,VSSOP, P, CAPACITOR-CHIP, PF, V,K,NP , ,TR CAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP, . UF, V,K,X R, ,TR CAPACITOR-CHIP, UF, V,K,X S, ,TR, . CAPACITOR-CHIP, . UF, . V,M,X R, ,TRCAPACITOR-CHIP, . UF, . V,M,X R, ,TR, CAPACITOR-CHIP, . PF, V,B,C G, ,TR, CAPACITOR-CHIP, UF, . V,M,X R, ,TR, CAPACITOR-CHIP, . UF, . V,M,X R, ,TR, CAPACITOR-CHIP, PF, V,K,X R, ,TR CAPACITOR-CHIP, . UF, V,K,X R, ,TR CAPACITOR-CHIP, PF, V,J,C G, ,TR, CAPACITOR-CHIP, PF, V,J,C G, ,TR,CAPACITOR-CHIP, . UF, V,K,X R, ,TR CAPACITOR-CHIP, . UF, . V,M,X R, ,TR, CAPACITOR-CHIP, PF, V,C,C G, ,TR, . INDUCTOR, . UH, , KHZ, A, . X X BEAD, OHM, , A, . OHM, INCH, MH BEAD, OHM, , A, . OHM, INCH, M BEAD, OHM, , MA, . OHM, INCH, INDUCTOR, . UH,+/- , MHZ, MA, . X .INDUCTOR, . UH,+/- , MHZ, . A, . X . INDUCTOR, . UH,+/- , MHZ, . A, . X . X INDUCTOR, . UH,+- , KHZ, A, . X . X INDUCTOR, . UH,+/- , MHZ, A, . X . X INDUCTOR, . UH,+- , MHZ, . A, . X . X INDUCTOR, . UH,+- , MHZ, A, . X . X . INDUCTOR, . UH,+- , KHZ, A, . X . X BEAD, OHM, , A, . OHM, INCH,IC,FLASH MEMORY, M,- + C, . . V, IC,PWM CONTROLLER, . - . V, KHZ- MHZ,T IC,TEMPERATURE SENSOR, . . V,VSSOP, P CAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP,. UF, . V,M,X R, ,TR CAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP, . UF, . V,K,X R, ,TR CAPACITOR-CHIP, . PF, V,C,C G, ,TR,CAPACITOR-CHIP, PF, V,J,C G, ,TR, . CAPACITOR-CHIP, . UF, . V,M,X R, ,TR CAPACITOR-CHIP, . UF, V,K,X R, ,TR BEAD- OHM- - . A- . OHM- INCH- INDUCTOR, . UH,+/- , KHZ, A, . X INDUCTOR, . UH,+/- , KHZ, . A, . X . INDUCTOR, . UH,+- , KHZ, A, . X . INDUCTOR, . UH,+/- , KHZ, A, . X .INDUCTOR, . UH,+- , KHZ, A, X . X INDUCTOR, . UH,+- , MHZ, A, . X . X IC,FLASH MEMORY, M,- + C, . . V, IC,TEMPERATURE SENSOR,MSOP, P,TR CAPACITOR-TA-SP, UF, . V,M,- + C, HINGE-W BRACKET,DISPLAY,LEFT, . MM, . HINGE-W BRACKET,DISPLAY,RIGHT, . MM, . HOLDER,BOTTOM IO,RIGHT,PC+ABSFAN,BLOWER, X X . MM, . CFM, . PA, MOUSE,USB, BUTTON,OPTICAL,BLACK PLATE,BACKING,CPU,SGCC BRACKET,MEMS,MIC,SGCC COVER,DISPLAY HINGE,LEFT,RAL T , X COVER,DISPLAY HINGE,RIGHT,RAL T , X COVER,DISPLAY HINGE,LEFT,RAL ,WLAN, COVER,DISPLAY HINGE,RIGHT,RAL ,WLAN,HINGE-W BRACKET,DISPLAY,LEFT, . . KGF- HINGE-W BRACKET,DISPLAY,RIGHT, . . KGF DIB,PEN,BLACK CABLE,ROUND, POS, MM,I,BASE GPIO CABLE,ROUND+FPC, POS, MM,I,HUB CABLE,FLAT, POS, MM,I,BASE HIGH SPEED CABLE,ROUND+FFC, POS, MM,I,CAMERA,ACS CAPACITOR-TANT, UF, V, ,- + C, .PART NO: H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H PO : INV: H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H HS CODE: CARTONS INTO PALLETS ( PALLETS + CARTONS) HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USAAS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY : HP INC. PAGE MILL ROAD SANTACLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2025-09-04	China	8962 Kgs	22 PKG
8	CMDUCHN2529206	TOUCH PAD,NO BUTTON, P, . X . ,GLAC DUMMY,SIM,PC+ABS+ TALC, CABLE,ROUND+FFC, POS, MM, I,CAMERA,ACS ASSEMBLY,CASE,BOTTOM,W/O, RJ , N, PART NO: H H H H H PO : INV: H H HH H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE,PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALOALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2025-09-04	China	9469 Kgs	22 PKG
9	CMDUCHN2529223	ASSEMBLY,CASE,REAR,DISPLAY, WLAN, X ASSEMBLY,CASE,DISPLAY,KIT, METEOR ASSEMBLY,CASE,REAR,DISPLAY, WWAN, X ASSEMBLY,CASE,REAR,DISPLAY,, WLAN,THICK, ASSEMBLY,TOP,W/O,KEYBOARD, SUB,RJ , ASSEMBLY,CASE,BOTTOM,W/O RJ , P PART NO: H H H H H HH H H H PO : INV:H H H H H H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USABY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2025-09-04	China	6528 Kgs	21 PKG
10	CMDUCHN2529190	SET,BEZEL,DISPLAY,IR, P ASSEMBLY,CASE,TOP,SUB,US ASSEMBLY,CASE,TOP,SUB,US PART NO: H H H PO :, INV: H H H HS CODE: CARTONS INTO PALLETS HPI-IMX - RAW MATERIALSALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT.NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC CHONGQING CO	2025-09-04	China	5780 Kgs	21 PKG

#	Importer	Last Address	Most Recent	No. of Containers	Gross Weight KGS
1	IEC TECHOLOGIES, S. DE R.L. DE C.V.	Los Angeles, California	2025-09-04	1069	5291042 Kgs
2	HP INC. C/O XPOLOGISTICS	Los Angeles, California	2024-01-14	800	6746123 Kgs
3	IEC TECHOLOGIES, S. DE R.L. DE C.	Long Beach, California	2025-07-06	248	865193 Kgs
4	HP INC.C/O RYDER LOGISTICS	Los Angeles, California	2018-12-08	58	569469 Kgs
5	HP INC. C/O RYDER LOGISTICS INDY	Long Beach, California	2024-01-14	25	235019 Kgs

#	Supplier	Last Address	Most Recent

More data available to paid subscribers

Sample Shipment From Hp Inc. C/o Inventec (Chongqing)

Bill of Lading CMDUSHZ7461581

Arrival Date: 2025-09-04

Container Number: BMOU4325412

Cargo #1
Description ASSEMBLY,TOP,THICK,KEYBOARD, SUB,AI+ NON ASSEMBLY,TOP,THICK RJ , KEYBOARD,SUB,PCB ASSEMBLY,MODULE,REAR,DISPLAY, WLAN PCB , PART NO:H H H H H H PO : INV:H H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E. IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
Keywords assembly top thick keyboard	HS-Code DATA UNAVAILABLE	Piece Count 486

Length 480	Height 108
Width 96	Load Status Loaded
Seal M4475937	Equipment Description CN
Type 40 Foot Dry Container, Opening at one or both end	Type of Service Pier to Pier
Container Type 40 Foot Dry Container, Opening at one or both end	Marks & Numbers N/M

Carrier COMPAGNIE MARITIME D-AFFRETEMENT	Carrier Code CMDU
Carrier Address 5701 LAKE WRIGHT DR	Carrier Contact Number DATA UNAVAILABLE
Ship Registered In DATA UNAVAILABLE	Foreign Port YANTIAN
Voyage Number 0TELK	Country of Origin CHINA
Vessel Name EVER MEMO	U.S. Port DATA UNAVAILABLE
Master Bill of Lading CMDUSHZ7461581	Weight (LB/KG) 14248.710000000001 / 6462
Quantity 486 CTN	Container Count 1
Place of Receipt YANTIAN	Distribution Port DATA UNAVAILABLE
House-v-Master DATA UNAVAILABLE	Measurement DATA UNAVAILABLE
In-Bond Entry-Type DATA UNAVAILABLE	Bill Type Code Regular Bill