|
1
|
CMDUSHZ7721620
|
SET,HOUSING,BOTTOM SET,BEZEL,DISPLAY,NON TOUCH,ACS, IC,AND GATE, . . V,SINGLE INPUT,SOT DIODE,ESD, V,SMD,WLCSP . X . - ,TR CONNECTOR,HDMI . +RJ ,COMBO, . / . DIODE,ESD, V,SMD,WLCSP . X . - ,TR TRANSISTOR-FET,NEMOS, V, A,DFN X , P,, CAPACITOR-CHIP, . UF, V,K,X R, ,TR, TRANSISTOR-FET,NEMOS, V, . A,LGA, P,TR TRANSISTOR-FET,NEMOS, V, . A,SMD, P,TR IC,TEMPERATURE SENSOR,QFN, P,TR IC,MOSFET DRIVER,+ + . V, A,FC-LGA- , IC,HUB CONTROLLER, . . V,USB . GEN P IC,PCI-E CARD READER CONTROLLER, . . V IC,PWM CONTROLLER, . . V, KHZ- MHZCONNECTOR,USB . , . / . MM,BLK, P, D, CONNECTOR,HDMI, . / . MM,BLK, P, D,DI CONNECTOR,DISPLAY PORT,DUAL, . / . / TRANSISTOR-FET,NMOSFET, V, A,PDFN X P DIODE,ESD, V,SMD,WLCSP . X . - ,TR DIODE,ESD, . V, MA,SMD,DFN P E,TR CAPACITOR-CHIP, . UF, . V,M,X R, ,TR, IC,DRIVER MOSFET, A,TQFN- , P,TRTRANSFORMER, / / G/ . G,SMD, P, . X TRANSISTOR-FET,NEMOS, V, A,PDFN X P, TRANSISTOR-FET,NEMOS, V, A,PDFN X P, TRANSISTOR-FET,NMOSFET, V, A,DFN , P CAPACITOR-CHIP, UF, V,M,X S, ,TR, . CAPACITOR-CHIP, UF, . V,M,X S, ,TR, DIODE-LED,RED/GRN/BLU, . X . , - / CAPACITOR-CHIP, . UF, V,K,X R, ,TR,IC,LOAD SWITCH,TDFN- X - , P,TR DIODE,SWCH, V, MA, MW,SMD,SOT- ,T DIODE,SCH, V, MA, MW, NS,SMD,SOT- TRANSISTOR,DUAL PNP,- V,- MA,SOT , CAPACITOR-AL-SP, UF, V,M,- + C,DX CAPACITOR-AL-SP, UF, V,M,- + C,DX CAPACITOR-AL-SP, UF, . V,M,- + C,D CONNECTOR,W TO B, . MM,ML,BLK, X , . MM,CAPACITOR-AL-SP, UF, . V,- /+ ,- CONNECTOR,FPC,BACK FLIP, . / . MM,FL,N CAPACITOR-CHIP, UF, V,M,X R, ,TR, . CAPACITOR-OS, UF, . V,M, C, . X . ,L BEAD, OHM, , MA, . OHM, INCH, CAPACITOR-CHIP, . UF, . V,M,X R, ,TR, ASSEMBLY,MODULE,CASE REAR,DISPLAY,WLAN, LATCH,BOTTOM COVER,POMHOLDER,BOTTOM IO,RIGHT,PC+ABS+ TALC, HOLDER,DISPLAY HINGE,PC+ABS, SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS COVER,DISPLAY HINGE,LEFT,RAL ,WWAN, COVER,DISPLAY HINGE,RIGHT,RAL ,WWAN, COVER,DISPLAY HINGE,RIGHT,RAL ,WLAN, FAN,BLOWER, MM, . CFM, . PA, V,COVER,CABLE,PC+ABS+ TALC BUTTON,BOTTOM COVER,PC+ABS+ TALC BUTTON,BOTTOM COVER,PC+ABS+ TALC COVER,CABLE,PC+ABS TALC ASSEMBLY,HOLDER,PCB ASSEMBLY,HOLDER,PCB ASSEMBLY,HOLDER,PCB ASSEMBLY,HOLDER,PCBPART NO: H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H PO :INV: H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H HH H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LISTTO REGION FOR DESTINATION ARRANGEMENT. NOTIFY : HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
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IEC TECHOLOGIES, S. DE R.L. DE C.V.
|
HP INC. C/O INVENTEC (CHONGQING)
|
2025-12-20
|
China
|
10093 Kgs
|
661 CTN
|
|
2
|
CMDUSHZ7721622
|
TAPE,ADHESIVE, MM, MM, . MM, M T,W GASKET,DISPLAY,RF,NI/CU PPW GASKET,GPU,SHIELDING,CF GASKET,LZF, MM, MM, . MM,CONDUCTIVE ADH BUMPER,DC,LED,SILICON RUBBER BUMPER,TOP,POWER REAR,SILICONE RUBBER, BUMPER,TOP,POWER,SILICONE RUBBER,, INSULATOR,THERMAL,HE GPU,DFR PAD,THERMAL,TP,GRAPHITE,K= W/MK, GASKET,GPU SHIELD,LZF/CF/MF ,UP, GASKET,GPU MR,LZF/CF/MF ,DOWN, GASKET,GPU HE,LZF/CF/MF ,DOWN, GASKET,LZF/CF/MF , MM, MM, . MM, PAD, MM, MM, MM,FSL-BSNA PAD, MM, MM, . MM,FSL-BSNAPAD, MM, MM, . MM,FSL-BSNA GASKET,DISPLAY, ACS,MYLAR GASKET,TOP,THPAD,CU+TT , GASKET,BXYZ-D, MM, MM, . MM GASKET,LZF/CF/MF , MM, MM, . MM GASKET,BXYZ-D, MM, MM, MM GASKET,GPU MR,BXYZ-D,UP GASKET,CF, . MM, MM, MMFOAM,DISPLAY CAMERA,THIN,JS-LOC-B , HINGE-W BRACKET,DISPLAY,LEFT, . . KGF- HINGE-W BRACKET,DISPLAY,RIGHT, . . KGF FFC,NFC, P, X X . MM, . / . MM,PET,G/F GASKET,BTY,CONDUCT FABRIC GASKET,BXYZ-D, MM, MM, . MM GASKET,BXYZ-D, MM, MM, MM GASKET,NI/CU PPW FR, . MM, MM, . MM,AUTGASKET,NI/CU PPW FR, MM, MM, . MM,AUTO INSULATOR,DISPLAY HINGE,DFR- ,ADHESIVE PAD,THERMAL,KB,GRAPHITE,K= W/MK, INSULATOR, MM, MM, . MM,PC FPC,LAN, L, X . X . MM, . / . MM,RA,D, FOAM,P , MM, MM, . MM,THIN FFC,SMART CARD, P, . X . X . MM, . / MODULE,FINGER PRINT,SOFT GREYHINGE-W BRACKET,DISPLAY,LEFT, . . KGF- HINGE-W BRACKET,DISPLAY,RIGHT, . . KGF FAN,BLOWER, MM, . CFM, . PA, V, BRACKET,RJ ,SGCC ASSEMBLY,HOLDER,PCB ASSEMBLY,HOLDER,PCB ASSEMBLY,HOLDER,PCB ASSEMBLY,HOLDER,PCBASSEMBLY,HOLDER,PCB ASSEMBLY,HOLDER,PCB ASSEMBLY,HOLDER,PCB ASSEMBLY,HOLDER,PCB ASSEMBLY,HOLDER,PCB ASSEMBLY,CASE,BOTTOM,W/O,RJ , N PART NO: H H H H HH H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H HPO : INV: H H H HH H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H HH H H H H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BBTO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY : HP INC. PAGE MILL ROAD SANTA CLARA PALOALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
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IEC TECHOLOGIES, S. DE R.L. DE C.V.
|
HP INC. C/O INVENTEC (CHONGQING)
|
2025-12-20
|
China
|
10977 Kgs
|
766 CTN
|
|
3
|
CMDUSHZ7721586
|
ASSEMBLY,CASE,BOTTOM,W/O,RJ , N ASSEMBLY,CASE,BOTTOM,W/O,RJ , N ASSEMBLY,TOP,THICK,KEYBOARD,SUB,AI+ NON ASSEMBLY,TOP,THICK,KEYBOARD,SUB,AI+ NON ASSEMBLY,CASE,BOTTOM,W/O,RJ , N ASSEMBLY,CASE,BOTTOM,W/O,RJ , N ASSEMBLY,CASE,BOTTOM,W/O,RJ , N, PART NO: H H H H H H H PO :INV: H H H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USABY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
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IEC TECHOLOGIES, S. DE R.L. DE C.V.
|
HP INC. C/O INVENTEC (CHONGQING)
|
2025-12-20
|
China
|
6302 Kgs
|
496 CTN
|
|
4
|
CMDUSHZ7721619
|
SET,BEZEL,DISPLAY,IR, W ASSEMBLY,CASE,BOTTOM,W/O,RJ , N ASSEMBLY,CASE,BOTTOM,W/O,RJ , N ASSEMBLY,CASE,BOTTOM,W/O,RJ , N PART NO: H H H H, PO : INV: H H H H HS CODE: CARTONS INTO PALLETSHPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATIONARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
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IEC TECHOLOGIES, S. DE R.L. DE C.V.
|
HP INC. C/O INVENTEC (CHONGQING)
|
2025-12-20
|
China
|
5470 Kgs
|
557 CTN
|
|
5
|
BKGASZF25110263
|
ELECTRIC FORKLIFT -HELI REACH TRUCK . T GC SLI
|
IEC TECHOLOGIES, S. DE R.L. DE C.V
|
INVENTEC (CHONGQING) CO LTD
|
2025-12-20
|
China
|
8070 Kgs
|
6 PKG
|
|
6
|
CMDUSHZ7611917
|
SET,COVER,TOP,PCR ASSEMBLY,CASE,BOTTOM,RJ THICK, W ASSEMBLY,CASE,BOTTOM,NRJ THIN- , TRANSISTOR-FET,NMOSFET, V, A,DFN , P PART NO:H H H H PO :, INV: H H H H HS CODE: CARTONS INTO PALLETS ( PALLETS + CARTONS) HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USABY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
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IEC TECHOLOGIES, S. DE R.L. DE C.V.
|
HP INC. C/O INVENTEC (CHONGQING)
|
2025-11-16
|
China
|
6513 Kgs
|
471 CTN
|
|
7
|
CMDUSHZ7611916
|
SET,COVER,TOP,PCR PART NO:H PO : INV: H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS, ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT.NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
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IEC TECHOLOGIES, S. DE R.L. DE C.V.
|
HP INC. C/O INVENTEC (CHONGQING)
|
2025-11-16
|
China
|
6443 Kgs
|
420 CTN
|
|
8
|
CMDUSHZ7591148
|
SET,DISPLAY,BEZEL,IR, SET,COVER,A,BLACK SET,POGO,RING,BLACK SET,COVER,A,BLACK SET,BUTTON,VOLUME,BLACK SET,VOLUME,BUTTON SET,AC RING,MALTA, SET,CASE,BEZEL,DISPLAY,METEOR SET,DISPLAY,BEZEL,NON AG, X IC,FLASH MEMORY, M,- + C, . . V, RESISTOR-CHIP, K, , / W, . A, ,TR SET,HOLDER,A SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , MM,MACH, . MM, . MM,CROSS,SCREW,I,M . , MM,MACH, . MM, . MM,CROSS, INSULATOR, MM, MM, . MM, D SHIELD,TOP,ABSORBER,DST- , ,MYLAR INSULATOR,PCB,L SHAPE,PC, . T, W FOAM,LED PCB,CR- , . MM COVER,TOP,POWER,PCFR E+TIO , X SET,HOUSING,BOTTOM SET,HOUSING,BOTTOMASSEMBLY,MODULE,REAR,DISPLAY,WWAN, P,IM PART NO: H H H H H H H H H H H H H H H H H H H H H H H H PO : INV: H H H HH H H H H H H H H H H H H H H H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LISTTO REGION FOR DESTINATION ARRANGEMENT. NOTIFY : HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
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IEC TECHOLOGIES, S. DE R.L. DE C.V.
|
HP INC. C/O INVENTEC (CHONGQING)
|
2025-10-25
|
China
|
9844 Kgs
|
650 CTN
|
|
9
|
CMDUSHZ7594033
|
DIODE,ESD, . V, A,SMD,CSP P Y,TR IC,POWER SWITCH,SOT - , P,TR DIODE,ESD, . V, MA,SMD,DFN P E,TR IC,REDRIVER,DE MUX,WQFN, P,TR IC,CONTROLLER, . V,WLCSP, P,TR IC,BUCK-BOOST CONTROLLER, . V,VQFN,, CAPACITOR-CHIP, UF, V, M,X R, ,TR CAPACITOR-CHIP, UF, V, M,X R, ,TR, . INDUCTOR, . UH, , MHZ, MA, . X X . CAPACITOR-CHIP, UF, V, M,X R, ,TR, .CAPACITOR-AL, UF, V,M, C, . X , / CAPACITOR-CHIP, UF, V,K,X R, ,TR IC,USB TYPE-C PORT CONTROLLER,QFN, P,TR IC,USB CONTROLLER HUB, -PORT, USB . ,QFN, SET,HOLDER,A ASSEMBLY,CASE,TOP,NRJ, PART NO:H HH H H H H H H H H H H H H H H H H PO : INV:H H H H H H H HH H H H H H H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LISTTO REGION FOR DESTINATION ARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
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IEC TECHOLOGIES, S. DE R.L. DE C.V.
|
HP INC. C/O INVENTEC (CHONGQING)
|
2025-10-25
|
China
|
13254 Kgs
|
653 CTN
|
|
10
|
CMDUSHZ7528509
|
ASSEMBLY,HUB,CAYMAN,ATTACHED,NO SD CAPACITOR-CHIP, PF, V,K,X R, ,TR, CONNECTOR,W TO B, . / . MM,ML,BLK, X , . CONNECTOR,W TO B, . MM,ML,BLK, X , . M CONNECTOR,B TO B, . / . MM,FL,NTU, X CONNECTOR,FPC,BACK FLIP, . / . MM,FL,B TRANSISTOR-FET,NEMOS, V, A,DFN X EP,, CAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP, PF, V,J,X R, ,TR CAPACITOR-CHIP- PF-K, V-X R- -TAP CAPACITOR-CHIP, PF, V,D,NP , ,TR,. CAP-CHIP- PF- V-K-X R- -TAP CAPACITOR-CHIP- . UF-M- . V-X R- -TA CAPACITOR-CHIP- . UF- . V-K-X R- -TA CAPACITOR-CHIP, . UF, V,K,X R, ,TACAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP, . UF, V,K,X R, ,TR, CAPACITOR-CHIP, UF, V,M,X R, ,TR CAPACITOR-CHIP, UF, V,K,X R, ,TR, . CAPACITOR-AL-SP, UF, . V,+ /- ,- + CONNECTOR,W TO B, . / . MM,ML,BLK, X BEAD, OHM, , A,. OHM, INCH, MHZ, INDUCTOR, . UH, , KHZ, A, . X . XBEAD, OHM, , A, . OHM, INCH, MH BEAD, OHM, , A, . OHM, INCH, INDUCTOR, . UH,+/- , KHZ, A, . X . INDUCTOR, . UH,+/- , KHZ, . A, . X . CHOKE, OHM,+/- , MA, . X . X . , INDUCTOR, . UH,+/- , MHZ, A, . X . X INDUCTOR, . UH,+/- , KHZ, . A, . X BEAD, OHM, , MA, . OHM, INCHBEAD, OHM, , MA, . OHM, MM, INDUCTOR, . UH,+/- , MHZ, MA, . X BEAD, OHM, , MA, . OHM, INCH, INDUCTOR, . UH, , KHZ, . A, . X . INDUCTOR, . UH, , KHZ, A, . X . X . BEAD, OHM,+/- , A, . OHM, MM, INDUCTOR, . UH,+- , KHZ, . X . X . M INDUCTOR, UH,+- , KHZ, A, . X . X MTRANSISTOR-FET,P-CHANNEL MOSFET,- V,- TRANSISTOR-FET,NEMOS, V, A,DFN X EP, IC,FLASH MEMORY, M,- + C, . . V, SOCKET,NANO SIM, P, . MM,GOLD FLASH, . CAPACITOR-OS, UF, . V,M, C, . X . ,L CAPACITOR-CHIP, UF, V,M,X R, ,TR, . DIODE,SCH, V, MA,SMD,SOT- ,TR DIODE,ESD, . V, A,SMD,DFN - L,TRDIODE,ESD, V,SMD,WLCSP . X . - ,TR DIODE,ESD, V,SMD,WLCSP . X . - ,TR DIODE,ESD, . V,SMD,SLP P X J,TR CONNECTOR,FPC,BACK FLIP, . MM,FL,WHT, X RESISTOR-M/F, . , , W, ,TR TRANSISTOR-FET,NEMOS, V, MA,SC- , P, TRANSISTOR-FET,PEMOS,- V,- . A,SOT , P TRANSISTOR-FET,DUAL NMOSFET, V, . A,SOIC,POWER SWITCH,SOT , P,TR IC,TEMPERATURE SENSOR,MSOP, P,TR IC,USB TYPE-C PD CONTROLLER, . V,VQFN, IC,SYNC STEP-DOWN REGULATOR, . VV, DIODE,SCH, V, MA,SMD,SOT- ,TR TRANSISTOR-FET,NEMOS, V, MA,SOT- , P TRANSISTOR-FET,PEMOS,- V,- A,PDFN X P SET,BOTTOM COVER,ASET,BCS,LENS,D,PMMA SET,A COVER,DOOR,W/O FINGER,W/O PAYMENT, SET,BEZEL STANDOFF,FF,M . , . MM, . MM,RND,SN, . STANDOFF,FF,M . , . MM, . MM,RND,SN, . STANDOFF,FF,M . , . MM, . MM,RND,SN, . CLIP, . MM, . MM, . MM,SUS / H,H= CLIP,PCB, . MM, MM, . MM,SUSFOAM,P , MM, MM, . MM,THICK FOAM,CR , MM, MM, . MM,WWAN -ROLL S BUMPER, . MM, . MM, . MM,SILICONE RUBB BUMPER, MM, . MM, . MM,SILICONE RUBBER INSULATOR,BRKT CPU,AMD,TS- -HB, FFC, P CLICK, X . X . MM, . / . MM,PET FFC, P ECOM, X . X . MM, . / . MM,PET, SPEAKER.W/HOUSING, OHM, W, X , X . XBUTTON,BOTTOM COVER,PC+ABS+ TALC LATCH,BOTTOM COVER,POM LENS,BCS,WINDOW,PMMA,TOP DOOR,DUMMY,SIM,C ,WHITE LENS,BCS,WINDOW,PMMA,BOT CABLE,ROUND+FPC, POS, MM,I,EDP,TOP,PR SPEAKER.W/HOUSING, OHM, W, X , . X DOOR,DUMMY,SIM,C ,BLACKHOLDER,CAMERA,PC+ABS FRAME,TOP,POWER,PCFR E, DUMMY,TOP,PEN,PC+ABS+ TALC, X BRACKET,THERMAL,CPU,SUS BRACKET,TOP,KEYBOARD,SGCC, COVER,DISPLAY HINGE,LEFT,RAL T , X COVER,DISPLAY HINGE,RIGHT,RAL T , X SHIELD,ASIDE,ABSORBER,DST- , ,MYLARPCB,LAN, L,FR ,HALOGEN FREE+ ROHS PCB,MB, L,FR ,HALOGEN FREE+ ROHS PCB,HUB, L, . X X . MM,FR ,HALOGEN FRE PCB,SC, L, . X . X . MM,FR ,HALOGEN FR PCB,USB, L,FR ,HALOGEN FREE+ ROHS PCB,ECOM, L, . X X . MM,FR ,HALOGEN FRE TRANSISTOR-FET,PEMOS,- V,- A,PDFN X P ASSEMBLY,HOLDER,PCBASSEMBLY,HOLDER,PCB ASSEMBLY,CASE,BOTTOM,SUB,NRJ THIN- , PART NO: H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HPO : INV: H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H HHS CODE: CARTONS INTO PALLETSHPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATIONARRANGEMENT. NOTIFY : HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
|
IEC TECHOLOGIES, S. DE R.L. DE C.V.
|
N/A
|
2025-10-12
|
China
|
9692 Kgs
|
609 CTN
|
