|
1
|
MCLMHKLGB2510010
|
PLYWOOD PLTS = CTNS HEAT SINK BOYD INV / HS CODE EXW SHIPMENT THIS SHIPMENT CONTAINS PLYWOOD PA CKING MATERIAL
|
N/A
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2025-11-11
|
Hong Kong
|
142 Kgs
|
15 CTN
|
|
2
|
KWEO520047275892
|
HEAT SINK
|
WISTRON INFOCOMM TECHNOLOGY
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2025-11-11
|
Hong Kong
|
849 Kgs
|
84 CTN
|
|
3
|
KWEO520047275376
|
HEAT SINK
|
WISTRON INFOCOMM TECHNOLOGY
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2025-11-11
|
Hong Kong
|
725 Kgs
|
80 CTN
|
|
4
|
TGFHTHKG7234604
|
HEAT SINK HS CODE: INV: PLT/ CTNSTHIS SHIPMENT CONTAINS NO WOOD PACKAGING MATERIALS
|
SL POWER ELECTRONICS CORP
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2025-11-10
|
Hong Kong
|
808 Kgs
|
50 CTN
|
|
5
|
TGFHTHKG7225902
|
HEAT SINK HS CODE: INV: CTNS/ PALLETTHIS SHIPMENT CONTAINS NO WOOD PACKING MATERIALS
|
SL POWER ELECTRONICS CORP
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2025-10-25
|
Hong Kong
|
2228 Kgs
|
108 CTN
|
|
6
|
KWEO520047270034
|
HEAT SINK
|
WISTRON INFOCOMM TECHNOLOGY
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2025-10-24
|
Hong Kong
|
144 Kgs
|
12 CTN
|
|
7
|
SHPTPHKS01441324
|
HEAT SINK
|
AVNET, INC.
|
BOYD SHENZHEN THERMAL SYSTEMS
|
2025-10-19
|
Hong Kong
|
108 Kgs
|
15 CTN
|
|
8
|
TGFHTHKG7215154
|
HEAT SINKHS CODE: INV: PLTS= CTNSTHIS SHIPMENT CONTAINS NO WOOD PACKAGING MATERIALS
|
SL POWER ELECTRONICS CORP
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2025-10-19
|
Hong Kong
|
5940 Kgs
|
360 CTN
|
|
9
|
HNLTSZA2590077
|
HEAT SINK BOYD INV# . HS CODE: . . CNTS( PALLETS) THIS SHIPPMENT CONTAINERS NO SOLID WOOD PACKING MATERIALS.
|
ESPEY MFG ELECTRONICS CORP
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2025-10-18
|
China
|
2289 Kgs
|
167 CTN
|
|
10
|
KWEO520047268494
|
HEAT SINK
|
WISTRON INFOCOMM TECHNOLOGY
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2025-10-07
|
Hong Kong
|
256 Kgs
|
40 CTN
|