1
|
HNLTSZA2560121
|
HEAT SINK BOYD INV#4557540.4557542. 60CNTS(5CASES+2PALLETS) HS CODE:8473.30.5100 THIS SHIPMENT CONTAINS NO SOLID WOOD PACKING MATERIALS.
|
ESPEY MFG & ELECTRONICS CORP
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2025-08-10
|
China
|
1567 Kgs
|
60 CTN
|
2
|
HNLTSZA24J0277
|
HEAT SINK BOYD INV#4340531. 77 CARTONS=(2 PALLETS) HS CODE:8473.30.5100 THIS SHIPMENT CONTAINS NO SOLID WOOD PACKING MATERIALS.
|
ESPEY MFG & ELECTRONICS CORP
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2025-01-10
|
China
|
1052 Kgs
|
77 CTN
|
3
|
SHPT29099866
|
TRANSFORMERS
|
ESPEY MFG & ELECTRONICS CORP.
|
N/A
|
2025-01-05
|
Sri Lanka
|
169 Kgs
|
2 PKG
|
4
|
HNLTSZA2470152
|
HEAT SINK BOYD INV#3867926.3867927. 83CNTS(8CASES+2PALLETS) THIS SHIPMENT
|
ESPEY MFG & ELECTRONICS CORP
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2024-08-27
|
China
|
2229 Kgs
|
83 CTN
|
5
|
HNLTSZA2450332
|
HEAT SINK BOYD INV#3821003.3821004. PO#135550 24CTNS=1PLT HS CODE:8473.30.5100
|
ESPEY MFG & ELECTRONICS CORP
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2024-07-03
|
China
|
320 Kgs
|
24 CTN
|
6
|
HNLTSZA2400650
|
HEAT SINK BOYD INV#3754810 PO#135550 HS
|
ESPEY MFG & ELECTRONICS CORP
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2024-04-15
|
China
|
223 Kgs
|
16 CTN
|
7
|
UASI7808822571
|
LB480150KVA RL LOAD BANK
|
ESPEY MFG ELECTRONICS CORP
|
HEBEI KAIXIANG ELECTRICAL TECHNOLOG
|
2024-03-10
|
China
|
1210 Kgs
|
1 CTN
|
8
|
HNLTSZA2400179
|
HEAT SINK BOYD INV#3649781 HS
|
ESPEY MFG & ELECTRONICS CORP
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2024-03-02
|
China
|
455 Kgs
|
25 CTN
|
9
|
HNLTSZA2400069
|
HEAT SINK BOYD INV#3647796. PO#135550 HS CODE:8473.30.5100 11CTNS=1PLT THIS SHIPMENT CONTAINS NO SOLID WOOD PACKING MATERIALS
|
ESPEY MFG & ELECTRONICS CORP
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2024-02-24
|
China
|
157 Kgs
|
11 CTN
|
10
|
HNLTSZA2400406
|
HEAT SINK BOYD INV#3695925 HS
|
ESPEY MFG & ELECTRONICS CORP
|
BOYD (SHENZHEN) THERMAL SYSTEMS LTD
|
2024-02-20
|
China
|
323 Kgs
|
24 CTN
|