1
|
112200013906033
|
NW306#&Thiếc hàn dạng hạt Sn96.5/Ag3.0/Cu0.5(Gồm:Tin 96.5%,Silver 3.0%,Copper 0.5%)
|
CôNG TY TNHH NEW WING INTERCONNECT TECHNOLOGY(BắC GIANG)
|
SHENZHEN QUNWIN SEMICONDUCTOR MATERIALS CO.,LTD
|
2022-01-13
|
CHINA
|
10000 KUNV
|
2
|
SF1084442328250
|
NW306#&Thiếc hàn dạng hạt Sn96.5/Ag3.0/Cu0.5(Gồm:Tin 96.5%,Silver 3.0%,Copper 0.5%)
|
CôNG TY TNHH NEW WING INTERCONNECT TECHNOLOGY(BắC GIANG)
|
SHENZHEN QUNWIN SEMICONDUCTOR MATERIALS CO.,LTD
|
2021-04-09
|
CHINA
|
8500 KUNV
|
3
|
112100012946457
|
NW306#&Thiếc hàn dạng hạt, Sn96.5/Ag3.0/Cu0.5(Gồm:Tin 96.5%,Silver 3.0%,Copper 0.5%)
|
CôNG TY TNHH NEW WING INTERCONNECT TECHNOLOGY(BắC GIANG)
|
SHENZHEN QUNWIN SEMICONDUCTOR MATERIALS CO.,LTD
|
2021-11-06
|
CHINA
|
750 KUNV
|
4
|
SF1127815829357
|
NW306#&Solder Ball Sn96.5/Ag3.0/Cu0.5(Gồm:Tin 96.5%,Silver 3.0%,Copper 0.5%)
|
CôNG TY TNHH NEW WING INTERCONNECT TECHNOLOGY(BắC GIANG)
|
SHENZHEN QUNWIN SEMICONDUCTOR MATERIALS CO.,LTD
|
2021-05-06
|
CHINA
|
750 KUNV
|