1
|
MCLMSHOAK2507001
|
SILICON WAFER UNDER EXW TERM THIS SHIPMENT CONTAINS NO SOLID WOODEN PACKAGING MATERIALS(SWPM)
|
PURE WAFER INC.
|
ZING SEMICONDUCTOR CORPORATION
|
2025-08-27
|
China
|
8160 Kgs
|
60 PKG
|
2
|
HNLTSH256A1399
|
SILICON WAFER
|
SILICON VALLEY MICROELECTRONICS,INC
|
ZING SEMICONDUCTOR CORPORATION
|
2025-08-05
|
China
|
2720 Kgs
|
20 PKG
|
3
|
MCLMSHOAK2506001
|
SILICON WAFER UNDER EXW TERM THIS SHIPMENT CONTAINS NO SOLID WOODEN PACKAGING MATERIALS(SWPM)
|
PURE WAFER INC.
|
ZING SEMICONDUCTOR CORPORATION
|
2025-07-03
|
China
|
5440 Kgs
|
40 PKG
|
4
|
MCLMSHOAK2505001
|
SILICON WAFER UNDER EXW TERM THIS SHIPMENT CONTAINS NO SOLID WOODEN PACKAGING MATERIALS(SWPM)
|
PURE WAFER INC.
|
ZING SEMICONDUCTOR CORPORATION
|
2025-06-27
|
China
|
5440 Kgs
|
40 PKG
|
5
|
DMERDFS067183765
|
SILICON WAFER
|
SILICON VALLEY MICROELECTRONICS,INC
|
ZING SEMICONDUCTOR CORPORATION
|
2025-06-22
|
China
|
2720 Kgs
|
20 PKG
|
6
|
DMALSHAH50851
|
SILICON WAFER
|
SILICON VALLEY MICROELECTRONICS,INC
|
ZING SEMICONDUCTOR CORP
|
2025-05-09
|
China
|
2720 Kgs
|
240 PKG
|
7
|
DFDSSHA71531820
|
SILICON WAFER
|
SILICON VALLEY MICROELECTRONICS,INC
|
ZING SEMICONDUCTOR CORPORATION
|
2025-04-12
|
China
|
2720 Kgs
|
20 PKG
|
8
|
MCLMSHOAK2412004
|
SILICON WAFER UNDER EXW TERM THIS SHIPMENT CONTAINS NO SOLID WOODEN PACKAGING MATERIALS(SWPM)
|
PURE WAFER INC.
|
ZING SEMICONDUCTOR CORPORATION
|
2025-01-24
|
China
|
5440 Kgs
|
40 PKG
|
9
|
DMERDFS067180441
|
SILICON WAFER
|
SILICON VALLEY MICROELECTRONICS,INC
|
ZING SEMICONDUCTOR CORPORATION
|
2025-01-18
|
China
|
2720 Kgs
|
20 PKG
|
10
|
DMERDFS067179911
|
SILICON WAFER
|
N/A
|
ZING SEMICONDUCTOR CORPORATION
|
2025-01-09
|
China
|
2720 Kgs
|
20 PLT
|