1
|
GBWQ6040651157
|
AVA CARD M.2 HEATSINK
|
OLA LOGISTICS / ECMMS
|
ZEHONG(GUANGZHOU)TECH.LTD
|
2024-06-14
|
China
|
305 Kgs
|
50 CTN
|
2
|
MOSJYESU140113
|
HARTZ FRONT CPU HS THERMAL MODULE HS CODE 84 .
|
EP LOGISTICS
|
ZEHONG (GUANGZHOU) TECH CO.LTD
|
2021-03-10
|
Hong Kong
|
553 Kgs
|
72 CTN
|
3
|
MOSJYESU140127
|
HPE DL345 GEN10 PLUS HIGH PERF H/S KIT HS COD.
|
EP LOGISTICS
|
ZEHONG (GUANGZHOU) TECH CO.LTD
|
2021-03-10
|
Hong Kong
|
179 Kgs
|
30 CTN
|
4
|
MOSJYESU140174
|
FAN MOTOR HS CODE 8414599050
|
EP LOGISTICS
|
ZEHONG (GUANGZHOU) TECH CO.LTD
|
2021-03-10
|
Hong Kong
|
1223 Kgs
|
90 CTN
|
5
|
MOCOYESU133938
|
HS CODE 8473309000 BOTTOM CLIP
|
WIWYNN CORPORATION
|
ZEHONG (GUANGZHOU) TECH. CO LTD
|
2020-04-22
|
Hong Kong
|
113 Kgs
|
20 CTN
|
6
|
MOCOYESU133914
|
HS CODE 84733090 HARTZ FRONT CPU HS THERMAL .
|
EP LOGISTICS
|
ZEHONG (GUANGZHOU) TECH. CO LTD
|
2020-04-22
|
Hong Kong
|
368 Kgs
|
48 CTN
|
7
|
PLUAYESU124666
|
TEXANS LOW-END CPU HS THERMAL MODULE
|
AURAS TECHNOLOGY INC
|
ZEHONG (GUANGZHOU) TECH CO LTD
|
2017-11-14
|
Hong Kong
|
437 Kgs
|
38 CTN
|
8
|
EXNWOE1307015A
|
AMP THERMAL MODULE
|
SAMSUNG ELECTRONICA DA AMAZONIA LTD
|
ZEHONG (GUANGZHOU) TECH CO LTD
|
2013-07-29
|
Hong Kong
|
120 Kgs
|
12 CTN
|
9
|
EXNWOE1304008C
|
HT-F5500 THERMAL MODULE MX-FS9000 THERMAL MOD.
|
SAMSUNG ELETRONICA DA AMAZONIA LTDA
|
ZEHONG (GUANGZHOU) TECH CO LTD
|
2013-04-22
|
Hong Kong
|
228 Kgs
|
19 CTN
|
10
|
EXNWOE1304001A
|
GENOA MFM THERMAL MODULE INTRANIST GOODS TO B.
|
SAMSUNG ELECTRONICA DA AMAZONIA LTD
|
ZEHONG (GUANGZHOU) TECH CO LTD
|
2013-04-16
|
Hong Kong
|
4 Kgs
|
1 CTN
|