|
1
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KWEO111040029260
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS ( . )
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN ETSU HANDOTAI CO., LTD.
|
2025-11-15
|
Japan
|
5153 Kgs
|
96 PKG
|
|
2
|
NXGWTYODES38233
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO.,LTD.
|
2025-11-08
|
Japan
|
2302 Kgs
|
187 CTN
|
|
3
|
KWEO111040074782
|
CARDBOARD BOX CUSHION ( . )
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO., LTD
|
2025-11-08
|
Japan
|
746 Kgs
|
150 CTN
|
|
4
|
KWEO111040029201
|
PLASTICS ( . )
|
SEH AMERICA INC M/S SEH AMERICA INC
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2025-11-08
|
Japan
|
8256 Kgs
|
80 PKG
|
|
5
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KWEO111040029024
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS ( . )
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN ETSU HANDOTAI CO., LTD.
|
2025-11-08
|
Japan
|
5742 Kgs
|
40 CAS
|
|
6
|
NXGWTYODEZ54396
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC
|
N/A
|
SHIN-ETSU HANDOTAI CO.,LTD.
|
2025-11-06
|
Japan
|
1553 Kgs
|
120 CTN
|
|
7
|
NXGWTYODES36634
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO.,LTD.
|
2025-10-31
|
Japan
|
5800 Kgs
|
480 CTN
|
|
8
|
KWEO111040029013
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS ( . )
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2025-10-31
|
Japan
|
11343 Kgs
|
162 PKG
|
|
9
|
KWEO111040074771
|
CARDBOARD BOX CUSHION ( . )
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2025-10-26
|
Japan
|
741 Kgs
|
150 CTN
|
|
10
|
KWEO111040029002
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS ( . )
|
S E H AMERICA. INC. (M/S65 2-396)
|
SHIN-ETSU HANDOTAI CO., LTD.
|
2025-10-26
|
Japan
|
11601 Kgs
|
90 PKG
|