1
|
DMERDFS012114910
|
12 RECLAIM WAFER - MECHANICAL WAFER .
|
SILICON VALLEY MICROELECTRONICS,INC
|
SCIENTECH CORPORATION
|
2024-06-08
|
China Taiwan
|
1170 Kgs
|
3 PKG
|
2
|
DMERDFS012114739
|
12 RECLAIM WAFER - MECHANICAL WAFER - CU .
|
SILICON VALLEY MICROELECTRONICS,INC
|
SCIENTECH CORPORATION
|
2024-06-01
|
China Taiwan
|
1170 Kgs
|
3 PKG
|
3
|
DFDSTP90042804
|
12 RECLAIM WAFER - NON-CU P TYPE(PARTICLE WAFER)-A
|
SILICON VALLEY MICROELECTRONICS,INC
|
SCIENTECH CORPORATION
|
2023-08-19
|
China Taiwan
|
390 Kgs
|
1 WDC
|
4
|
DFDSTP90038961
|
12 RECLAIM WAFER - NON-CU P
|
SILICON VALLEY MICROELECTRONICS,INC
|
SCIENTECH CORPORATION
|
2023-06-27
|
China Taiwan
|
1925 Kgs
|
5 WDC
|
5
|
DMERDFS012107904
|
12 RECLAIM WAFER - NON-CU . .
|
N/A
|
SCIENTECH CORPORATION
|
2022-12-07
|
China Taiwan
|
1535 Kgs
|
4 PKG
|
6
|
DMERDFS012107139
|
12 RECLAIM WAFER - NON-CU . .
|
N/A
|
SCIENTECH CORPORATION
|
2022-10-21
|
China Taiwan
|
764 Kgs
|
2 PKG
|
7
|
DMERDFS012106824
|
12 RECLAIM WAFER - NON-CU (PARTICLE WAFER) . .
|
N/A
|
SCIENTECH CORPORATION
|
2022-10-02
|
China Taiwan
|
1146 Kgs
|
3 PKG
|
8
|
SCNL3US2208010
|
12 RECLAIM WAFER NON_CU PARTICLE WAFER INV NO 230 2022070075 76 EX WORK TERM . .
|
N/A
|
SCIENTECH CORPORATION
|
2022-09-01
|
China Taiwan
|
1528 Kgs
|
4 WDC
|
9
|
SCNL3US2112024
|
27 PKGS 3WDC 2PLT 24CTNS 5 PKGS 12 RECLAIM WAFER NON_CU PARTICLE WAFER INV NO 230 2021110157 158 HS CODE 3818 00 EX WORK TERM
|
N/A
|
SCIENTECH CORPORATION
|
2022-01-05
|
China Taiwan
|
1455 Kgs
|
27 PKG
|
10
|
DMERDFS012102056
|
12 RECLAIM WAFER - NON CU (PARTICLE WAFER)
|
N/A
|
SCIENTECH CORPORATION
|
2021-12-04
|
China Taiwan
|
527 Kgs
|
48 PKG
|