1
|
DMALSGN083279
|
07 PACKAGES = 07 WOODEN CASES SCRAPS : LEAD FRAME SCRAP ( TIN PLATE COPPER ) CUT SUBSTRATE SCRAP DEFECTIVE HIC (AFTER MOLD)
|
ON SEMICONDUCTOR
|
SANYO SEMICONDUCTOR VIETNAM CO
|
2014-07-23
|
Hong Kong
|
2326 Kgs
|
7 PKG
|
2
|
DMALSGN078041
|
12 PACKAGES = 12 WOODEN CASES SCRAPS: LEAD FRAME SCRAP (COPPER WITH TIN PLATING) CUT SUBSTRATE SCRAP (ALUMINUM _ 100% TARGETS/
|
ON SEMICONDUCTOR
|
SANYO SEMICONDUCTOR VIETNAM CO
|
2014-02-11
|
Hong Kong
|
7867 Kgs
|
12 PKG
|
3
|
DMALSGN075868
|
16 PACKAGES = 16 WOODEN CASES SCRAPS: LEAD FRAME SCRAP (COPPER WITH TIN PLATING) CUT SUBSTRATE SCRAP (ALUMINUM _ 100% TARGETS/
|
ON SEMICONDUCTOR
|
SANYO SEMICONDUCTOR VIETNAM CO
|
2013-11-21
|
Hong Kong
|
9362 Kgs
|
16 PKG
|
4
|
DMALSGN073491
|
SCRAPS: LOT 202 CUT SUBSTRATE SCRAP (ALUMINUM 90-99%) LOT 202 SUBSTRATE POWDER (ALUMINUM 90-99%) LOT 205 LEAD FRAME SCRAP( COPPER WITH TIN
|
ON SEMICONDUCTOR RECLAMATION CENTER
|
SANYO SEMICONDUCTOR VIETNAM CO
|
2013-09-20
|
Hong Kong
|
11870 Kgs
|
27 PKG
|
5
|
DMALSGN073920
|
19 PACKAGES = 19 WOODEN CASES SCRAPS: LOT 202 CUT SUBSTRATE SCRAP (ALUMINUM 90-99%) LOT 205 LEAD FRAME SCRAP( COPPER WITH TIN
|
ON SEMICONDUCTOR
|
SANYO SEMICONDUCTOR VIETNAM CO
|
2013-09-05
|
Hong Kong
|
9928 Kgs
|
19 PKG
|
6
|
DMALSGN073378
|
38 PACKAGES = 38 WOODEN CASES SCRAPS: LOT 202 CUT SUBSTRATE SCRAP (ALUMINUM 90-99%) LOT 228 DEFECTIVE SUBSTRATE (MIXED UNITS)
|
ON SEMICONDUCTOR RECLAMATION CENTER
|
SANYO SEMICONDUCTOR VIETNAM CO
|
2013-08-22
|
Hong Kong
|
16982 Kgs
|
38 PKG
|
7
|
DMALSGN072580
|
33 PACKAGES = 33 WOODEN CASES SCRAPS: LOT 202 CUT SUBSTRATE SCRAP (ALUMINUM 90-99%) LOT 205 LEAD FRAME SCRAP (COPPER WITH TIN PLATING)
|
ON SEMICONDUCTOR RECLAMATION CENTER
|
SANYO SEMICONDUCTOR VIETNAM CO
|
2013-08-02
|
Hong Kong
|
13496 Kgs
|
33 PKG
|
8
|
DMALSGN070457
|
SCRAPS & DEFECTIVE PRODUCTS: LEAD FRAME SCRAP (COPPER WITH TIN PLATING) CUT SUBSTRATE SCRAP (ALUMINUM _ 100% TARGETS/ MATERIAL)
|
ON SEMICONDUCTOR
|
SANYO SEMICONDUCTOR VIETNAM CO
|
2013-05-16
|
Hong Kong
|
11475 Kgs
|
20 WDC
|
9
|
DMALSGN069971
|
SCRAPS & DEFECTIVE PRODUCTS: LEAD FRAME CUT/FLAKES SUBSTRATE CUT/FLAKES DUMMY/DEFECTIVE IC WAFER/DIES HS CODE:74040000,
|
ON SEMICONDUCTOR RECLAMATION CENTER
|
SANYO SEMICONDUCTOR VIETNAM CO
|
2013-04-26
|
Hong Kong
|
11575 Kgs
|
21 CRT
|
10
|
YASVNLSGN0013238
|
SCRAPS - DEFECTIVE PRODUCTS CUT SUBSTRATE SCRAP (ALUMINUM 90-99%) DEFECTIVE SUBSTRATE SCRAP
|
ON SEMICONDUCTOR RECLAMATION CENTER
|
SANYO SEMICONDUCTOR(VIETNAM)CO.,LTD
|
2013-03-05
|
China Taiwan
|
28203 Kgs
|
59 PCS
|