|
1
|
EMLTHKGS00275648
|
HEAT SINK
|
CLOUD NETWORK TECHNOLOGY SINGAPORE
|
NIDEC CHAUN CHOUNG TECHNOLOGY CORP
|
2025-10-24
|
Hong Kong
|
1198 Kgs
|
140 CTN
|
|
2
|
DFDSHKG1354692
|
HEAT SINK USE FOR ELECTRONICAL
|
MFG PRO, TIJUANA, MX C/O JD GROUP
|
NIDEC CHAUN CHOUNG TECHNOLOGY CORP
|
2025-10-21
|
China Taiwan
|
292 Kgs
|
19 CTN
|
|
3
|
EMLTHKGS00272371
|
COMPUTER PARTS (HEAT SINK)
|
TRANS EXPEDITE INC
|
NIDEC CHAUN CHOUNG TECHNOLOGY CORP
|
2025-10-19
|
Hong Kong
|
139 Kgs
|
28 CTN
|
|
4
|
TFRASHAS25090049
|
THERMAL MODULE
|
QCH, INC., A NEVADA CORPORATION
|
NIDEC CHAUN CHOUNG TECHNOLOGY
|
2025-10-17
|
China
|
4868 Kgs
|
600 CTN
|
|
5
|
TFRASHAS25090050
|
THERMAL MODULE
|
QCH, INC., A NEVADA CORPORATION
|
NIDEC CHAUN CHOUNG TECHNOLOGY
|
2025-10-17
|
China
|
3030 Kgs
|
374 CTN
|
|
6
|
TFRASHAS25090051
|
THERMAL MODULE
|
QCH, INC., A NEVADA CORPORATION
|
NIDEC CHAUN CHOUNG TECHNOLOGY
|
2025-10-17
|
China
|
3485 Kgs
|
429 CTN
|
|
7
|
EMLTHKGS00266809
|
HEAT SINK
|
CLOUD NETWORK TECHNOLOGY SINGAPORE
|
NIDEC CHAUN CHOUNG TECHNOLOGY CORP
|
2025-10-07
|
Hong Kong
|
121 Kgs
|
24 CTN
|
|
8
|
EMLTHKGS00270688
|
HEAT SINK
|
CLOUD NETWORK TECHNOLOGY SINGAPORE
|
NIDEC CHAUN CHOUNG TECHNOLOGY CORP
|
2025-10-07
|
Hong Kong
|
154 Kgs
|
28 CTN
|
|
9
|
EMLTHKGS00270183
|
HEAT SINK
|
CLOUD NETWORK TECHNOLOGY SINGAPORE
|
NIDEC CHAUN CHOUNG TECHNOLOGY CORP
|
2025-10-07
|
Hong Kong
|
94 Kgs
|
9 CTN
|
|
10
|
EMLTHKGS00269673
|
HEAT SINK
|
CLOUD NETWORK TECHNOLOGY SINGAPORE
|
NIDEC CHAUN CHOUNG TECHNOLOGY CORP
|
2025-10-07
|
Hong Kong
|
1134 Kgs
|
189 CTN
|