1
|
MLCWTAO18040381
|
WAFER BOX
|
NXP USA, INC.
|
FREESCALE SEMICONDUCTOR(CHINA)
|
2018-05-27
|
China
|
630 Kgs
|
70 PKG
|
2
|
MLCWTAO18040356
|
WAFER BOX
|
NXP USA, INC.
|
FREESCALE SEMICONDUCTOR(CHINA)
|
2018-05-08
|
South Korea
|
450 Kgs
|
50 PKG
|
3
|
MLCWTAO18020373
|
WAFER BOX
|
NXP USA, INC.
|
FREESCALE SEMICONDUCTOR(CHINA)
|
2018-02-28
|
China
|
460 Kgs
|
50 CTN
|
4
|
MLCWTAO17120354
|
WAFER BOX
|
NXP USA, INC.
|
FREESCALE SEMICONDUCTOR(CHINA)
|
2017-12-26
|
South Korea
|
460 Kgs
|
50 CTN
|
5
|
MLCWTAO17090366
|
WAFER BOX
|
NXP USA, INC.
|
FREESCALE SEMICONDUCTOR(CHINA)
|
2017-10-17
|
China
|
276 Kgs
|
30 CTN
|
6
|
TCIJSC12NY7F735
|
COVER TAPE
|
MICROSEAL INDUSTRIES INC
|
FREESCALE SEMICONDUCTOR CHINA LTD
|
2017-07-18
|
South Korea
|
1729 Kgs
|
72 CTN
|
7
|
MLCWTAO17050355
|
WAFER BOX
|
NXP SEMICONDUCTOR
|
FREESCALE SEMICONDUCTOR(CHINA)
|
2017-06-09
|
China
|
400 Kgs
|
40 CTN
|
8
|
MLCWTAO17020362
|
NO#42 LEFTOVER MATERIAL OF BGA NO#33A BLUE TAPE (MYLAR) NO#33B: SCRAP DIE (INKED) NO#228 LEAD FRAME WITH MOLDING COMPOUND ( CU ) NO#204 LEAD FRAME WITHOUT MOLDING COMPOUND ( CU), NO#1 IC DEVICE W/ ENCAPSULATION, PLASTIC NO#41 IC OF BGA NO#39 SUBSTRATE OF BGA NO#203 COPPER WIRE - BARE (NO INSULATION) NO#201 ALUMINUM WIRE
|
NXP SEMICONDUCTOR
|
FREESCALE SEMICONDUCTOR(CHINA)
|
2017-03-30
|
China
|
5814 Kgs
|
31 PKG
|
9
|
MLCWTAO17010358
|
NO#42 LEFTOVER MATERIAL OF BGA NO#33A BLUE TAPE (MYLAR) NO#33B: SCRAP DIE (INKED) NO#228 LEAD FRAME WITH MOLDING COMPOUND (CU) NO#204 LEAD FRAME WITHOUT MOLDING COMPOUND ( CU) NO#1 IC DEVICE W/ ENCAPSULATION, PLASTIC, NO#41 IC OF BGA NO#31 WAFER WITH DIE (BROKEN) NO#39 SUBSTRATE OF BGA
|
NXP SEMICONDUCTOR
|
FREESCALE SEMICONDUCTOR(CHINA)
|
2017-02-19
|
China
|
5956 Kgs
|
31 PKG
|
10
|
MLCWTAO16110361
|
NO#42 LEFTOVER MATERIAL OF BGA NO#33A BLUE TAPE (MYLAR) NO#33B: SCRAP DIE (INKED) NO#228 LEAD FRAME WITH MOLDING COMPOUND ( CU NO#204 LEAD FRAME WITHOUT MOLDING COMPOUND ( CU) NO#1 IC DEVICE W/ ENCAPSULATION, PLASTIC, NO#41 IC OF BGA NO#39 SUBSTRATE OF BGA NO#31 WAFER WITH DIE (BROKEN)
|
NXP SEMICONDUCTOR
|
FREESCALE SEMICONDUCTOR(CHINA)
|
2016-12-23
|
China
|
6527 Kgs
|
30 PKG
|