1
|
DMERDFS035127654
|
EMI GASKET
|
CAL-COMP ELECTRONICS (USA) CO. LTD
|
DONG ZE TECH DEVELOPMENT CO LTD
|
2021-01-01
|
Hong Kong
|
26 Kgs
|
2 CTN
|
2
|
DMERDFS035127091
|
EMI GASKET
|
CAL-COMP ELECTRONICS (USA) CO. LTD
|
DONGZE TECH DEVELOPMENT CO LTD
|
2020-12-17
|
Hong Kong
|
18 Kgs
|
2 CTN
|
3
|
DMERDFS035081566
|
EMI INSULATION SLICES
|
CAL-COMP ELECTRONICS DE MEXICO CO
|
DONGZE TECH DEVELOPMENT CO LTD
|
2015-09-29
|
Hong Kong
|
115 Kgs
|
7 CTN
|
4
|
DMERDFS035081264
|
INSULATION SLICES EIM
|
CAL-COMP ELECTRONICS DE MEXICO CO
|
DONGZE TECH DEVELOPMENT CO LTD
|
2015-09-17
|
Hong Kong
|
30 Kgs
|
3 CTN
|
5
|
DMERDFS035080206
|
INSULATION SLICES EIM
|
CAL-COMP ELECTRONICS DE MEXICO CO
|
DONGZE TECH DEVELOPMENT CO LTD
|
2015-08-11
|
Hong Kong
|
117 Kgs
|
8 CTN
|
6
|
DMERDFS035079818
|
INSULATION SLICES EIM
|
CAL-COMP ELECTRONICS DE MEXICO CO
|
DONGZE TECH DEVELOPMENT CO LTD
|
2015-07-28
|
Hong Kong
|
124 Kgs
|
8 CTN
|
7
|
DMERDFS035079029
|
INSULATION SLICES
|
CAL-COMP ELECTRONICS DE MEXICO CO
|
DONGZE TECH DEVELOPMENT CO LTD
|
2015-07-17
|
China
|
115 Kgs
|
6 CTN
|
8
|
DMERDFS035073513
|
EMI INSULATION SLICES
|
CAL-COMP ELECTRONICS DE MEXICO CO
|
DONGZE TECH DEVELOPMENT CO LTD
|
2015-01-07
|
Hong Kong
|
81 Kgs
|
5 CTN
|
9
|
DMERDFS035070200
|
EMI
|
CAL-COMP ELECTRONICS DE MEXICO CO
|
DONGZE TECH DEVELOPMENT CO LTD
|
2014-09-11
|
Hong Kong
|
129 Kgs
|
8 CTN
|
10
|
HYSL372393
|
SPONGESSEA/AIR CARGO VIA USA
|
THOMSON MULTIMIDIA LTDA
|
DONGZE TECH. DEVELOPMENT CO LTD
|
2009-10-03
|
Hong Kong
|
290 Kgs
|
20 CTN
|