1
|
DMALHKGC54590
|
HEAT SINK
|
FUTURE ELECTRONICS
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2025-09-07
|
Hong Kong
|
204 Kgs
|
14 CTN
|
2
|
DMALSZXC95636
|
HEAT SINK
|
DANFOSS DRIVES
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2025-08-21
|
China
|
4170 Kgs
|
10 PKG
|
3
|
DMALSZXD00414
|
HEAT SINK
|
BOYD CORPORATION
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2025-08-03
|
China
|
1560 Kgs
|
182 CTN
|
4
|
DMALHKGC50514
|
HEAT SINK
|
FUTURE ELECTRONICS
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2025-08-02
|
Hong Kong
|
251 Kgs
|
19 CTN
|
5
|
DMALHKGC51460
|
HEAT SINK
|
FUTURE ELECTRONICS
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2025-08-02
|
China
|
4550 Kgs
|
508 CTN
|
6
|
DMALSZXC98176
|
COPPER & ALUMINUM HEAT SINK FOR SERVER THERMAL DISSIPATION
|
EMC CORP
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2025-07-28
|
China
|
614 Kgs
|
67 CTN
|
7
|
DMALSZXC93606
|
HEAT SINK
|
DANFOSS DRIVES
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2025-07-26
|
China
|
566 Kgs
|
2 PKG
|
8
|
DMALSZXC98303
|
COPPER & ALUMINUM HEAT SINK FOR SERVER THERMAL DISSIPATION
|
EMC CORP FRANKLIN MFG
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2025-07-13
|
China
|
305 Kgs
|
42 CTN
|
9
|
DMALSZXC89731
|
HEAT SINK
|
DANFOSS DRIVES
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2025-06-27
|
China
|
283 Kgs
|
1 PKG
|
10
|
DMALHKGC48327
|
HEAT SINK
|
FUTURE ELECTRONICS
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2025-06-09
|
Hong Kong
|
989 Kgs
|
167 CTN
|