1
|
ILCDCS2508019
|
ELECTRONIC ASSEMBLY
|
BLENDTEC
|
B.M. NAGANO INDUSTRIES SDN BHD
|
2025-09-09
|
Hong Kong
|
504 Kgs
|
76 CTN
|
2
|
ILCDCS2507108
|
ELECTRONIC ASSEMBLY---HS CODE : 8473.30
|
BLENDTEC
|
B.M. NAGANO INDUSTRIES SDN BHD
|
2025-08-22
|
Singapore
|
115 Kgs
|
14 CTN
|
3
|
DBGASKUL00432016
|
AIRVELOCITY 1500
|
AIRSPAN US RMA CENTER.
|
B.M. NAGANO INDUSTRIES SDN BHD
|
2025-08-08
|
Malaysia
|
1322 Kgs
|
4 PKG
|
4
|
ILCDCS2506075
|
PO3157353-1 ELECTRONIC ASSEMBLY 15-370-01 HS CODE : 8473 30 1000
|
BLENDTEC
|
B.M. NAGANO INDUSTRIES SDN BHD
|
2025-08-04
|
Hong Kong
|
291 Kgs
|
48 CTN
|
5
|
ILCDCS2506013
|
24 CARTONS PACKED IN 1 PALLETS OF PO3156721-2PCBA ES3 UNIVERSAL 15-319-03 HS CODE: 8473.3 0.1000
|
BLENDTEC
|
B.M. NAGANO INDUSTRIES SDN BHD
|
2025-07-13
|
Hong Kong
|
193 Kgs
|
24 CTN
|
6
|
ILCDCS2505089
|
ELECTRONIC ASSEMBLY HS CODE : 8473 30 1000
|
BLENDTEC
|
B.M. NAGANO INDUSTRIES SDN BHD
|
2025-06-25
|
Singapore
|
507 Kgs
|
2 PKG
|
7
|
ILCDCS2410067
|
PRINTED CIRCUIT BOARD ASSEMBLY (PCBA)
|
BLENDTEC
|
BM NAGANO INDUSTRIES SDN BHD
|
2024-12-08
|
Hong Kong
|
456 Kgs
|
2 PKG
|
8
|
ILCDCS2410014
|
1 PACKAGES CONSIST OF 1 PALLET OF PRINTED CIRCUIT BOARD ASSEMBLY (PCBA)
|
BLENDTEC
|
B.M.NAGANO INDUSTRIES SDN BHD
|
2024-11-20
|
Japan
|
194 Kgs
|
1 CTN
|
9
|
ILCDCS2408028
|
SAID TO CONTAIN24 CARTONS PACKED INTO 1 PALLETPRINTED CIRCUIT BOARD ASSEMBLY(PCBA)
|
BLENDTEC
|
B.M.NAGANO INDUSTRIES SDN BHD
|
2024-09-20
|
Malaysia
|
192 Kgs
|
24 CTN
|
10
|
CHSL444837206JHB
|
PART OF 1X20GP PHOTOCOPY MACHINE PARTS INV BDXRX2023-0728-004 QTY 1 PKG G W 140.60 KGS M 3 1.584 M3 B.M. NAGANO INDUSTRIES SDN BHD HS CODE 844399 ON BEHALF OF NIPPON EXPRESS M SDN BHD EMAIL XEROX.ROC@CEVALOGISTICS.COM
|
XEROX C/O PIERCE INDUSTRIES LLC
|
B.M. NAGANO INDUSTRIES SDN BHD
|
2023-09-28
|
China Taiwan
|
141 Kgs
|
1 PKG
|