|
1
|
ILCDCS2510032
|
PO - ELECTRONIC ASSEMBLY PO - ELECTRONIC ASSEMBLY PO - ELECTRONIC ASSEMBLY--HS CODE: .
|
BLENDTEC
|
B.M. NAGANO INDUSTRIES SDN BHD
|
2025-11-13
|
Singapore
|
515 Kgs
|
79 CTN
|
|
2
|
ILCDCS2509033
|
ELECTRONIC ASSEMBLY---HS CODE : .
|
BLENDTEC
|
B.M. NAGANO INDUSTRIES SDN BHD
|
2025-10-15
|
Singapore
|
222 Kgs
|
34 CTN
|
|
3
|
ILCDCS2508019
|
ELECTRONIC ASSEMBLY
|
BLENDTEC
|
B.M. NAGANO INDUSTRIES SDN BHD
|
2025-09-09
|
Hong Kong
|
504 Kgs
|
76 CTN
|
|
4
|
ILCDCS2507108
|
ELECTRONIC ASSEMBLY---HS CODE : 8473.30
|
BLENDTEC
|
B.M. NAGANO INDUSTRIES SDN BHD
|
2025-08-22
|
Singapore
|
115 Kgs
|
14 CTN
|
|
5
|
DBGASKUL00432016
|
AIRVELOCITY 1500
|
AIRSPAN US RMA CENTER.
|
B.M. NAGANO INDUSTRIES SDN BHD
|
2025-08-08
|
Malaysia
|
1322 Kgs
|
4 PKG
|
|
6
|
ILCDCS2506075
|
PO3157353-1 ELECTRONIC ASSEMBLY 15-370-01 HS CODE : 8473 30 1000
|
BLENDTEC
|
B.M. NAGANO INDUSTRIES SDN BHD
|
2025-08-04
|
Hong Kong
|
291 Kgs
|
48 CTN
|
|
7
|
ILCDCS2506013
|
24 CARTONS PACKED IN 1 PALLETS OF PO3156721-2PCBA ES3 UNIVERSAL 15-319-03 HS CODE: 8473.3 0.1000
|
BLENDTEC
|
B.M. NAGANO INDUSTRIES SDN BHD
|
2025-07-13
|
Hong Kong
|
193 Kgs
|
24 CTN
|
|
8
|
ILCDCS2505089
|
ELECTRONIC ASSEMBLY HS CODE : 8473 30 1000
|
BLENDTEC
|
B.M. NAGANO INDUSTRIES SDN BHD
|
2025-06-25
|
Singapore
|
507 Kgs
|
2 PKG
|
|
9
|
ILCDCS2410067
|
PRINTED CIRCUIT BOARD ASSEMBLY (PCBA)
|
BLENDTEC
|
BM NAGANO INDUSTRIES SDN BHD
|
2024-12-08
|
Hong Kong
|
456 Kgs
|
2 PKG
|
|
10
|
ILCDCS2410014
|
1 PACKAGES CONSIST OF 1 PALLET OF PRINTED CIRCUIT BOARD ASSEMBLY (PCBA)
|
BLENDTEC
|
B.M.NAGANO INDUSTRIES SDN BHD
|
2024-11-20
|
Japan
|
194 Kgs
|
1 CTN
|