1
|
PICMKAOA2407049
|
145 CTNS = 10 PALLETS IC / INK WAFER .
|
SEMICONDUCTOR RELIABILITY
|
ADVANCED SEMICONDUCTOR
|
2024-08-23
|
China Taiwan
|
2592 Kgs
|
145 CTN
|
2
|
PICMTPOA2406022
|
SUBSTRATE 40 CARTONS = 1 PALLET .
|
SEMICONDUCTOR RELIABILITY
|
ADVANCED SEMICONDUCTOR
|
2024-07-09
|
China Taiwan
|
278 Kgs
|
40 CTN
|
3
|
PICMKAOA2402019
|
25CTNS=18CTNS(2PLTS)+7CTNS=9PKGS SUBSTRATE/ BIC / WAFER 7 CTNS
|
SEMICONDUCTOR RELIABILITY
|
ADVANCED SEMICONDUCTOR
|
2024-03-04
|
China Taiwan
|
254 Kgs
|
25 CTN
|
4
|
PICMKAOA2305057
|
WAFER/SUBSTRATE/DIE/PACKAGE IC HS CODE 85340 . .
|
SEMICONDUCTOR RELIABILITY
|
ADVANCED SEMICONDUCTOR
|
2023-06-19
|
China Taiwan
|
4332 Kgs
|
41 PKG
|
5
|
OSTITPLAX21C0806
|
INTEGRATED CIRCUITS HS CODE 8542 39 . .
|
ARROW RECOVERY GROUP INC.
|
ADVANCED SEMICONDUCTOR
|
2022-02-12
|
China Taiwan
|
72 Kgs
|
4 CTN
|
6
|
PSLAE20047018WMG
|
IC(Intergrated circuit )/CSP IC(Chip Scale Package IC)/DICE 528 PKGS {[516INNE(6PLTS)+12CTNS]18PKGS}
|
METALLIX REFINING
|
ADVANCED SEMICONDUCTOR
|
2020-05-21
|
China Taiwan
|
432 Kgs
|
528 PKG
|
7
|
AMIGL190435570A
|
ETHYL BORAT TRIMETHYL PHOSPHITE PURPOSE:THEY CAN BE USED FOR MATERIALS
|
FUJIFILM ELECTRONIC MATERIALS USA
|
ADVANCED SEMICONDUCTOR
|
2019-11-04
|
China
|
253 Kgs
|
6 PKG
|
8
|
AMIGL190256989A
|
EMPTY STEEL DRUM
|
FUJIFILM ELECTRONIC MATERIALS USA
|
ADVANCED SEMICONDUCTOR
|
2019-08-16
|
China
|
381 Kgs
|
9 PKG
|
9
|
AMIGL190024104A
|
EMPTY STEEL DRUM ETHYL BORATE PURPOSE:IT CAN BE USED FOR MATERIALS
|
FUJIFILM ELECTRONIC MATERIALS USA
|
ADVANCED SEMICONDUCTOR
|
2019-02-16
|
China
|
126 Kgs
|
3 PKG
|
10
|
AMIGL180493823A
|
5-GALLON SS DYNAMAX RESIDUE LAST PURPOSE:IT CAN BE USED FOR MATERIALS
|
FUJIFILM ELECTRONIC MATERIALS USA
|
ADVANCED SEMICONDUCTOR
|
2018-10-12
|
China
|
272 Kgs
|
3 CTN
|