1
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SEMI CONDUCTOR MANUFACTURING EQUIPMENT DIE FOR SINGULATION LEAD CUTTING/FORMING MACHINE OF MODEL NO:NUZ-0003 FOR 5630 TY
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HINDUSTAN SEMICONDUCTORS LIMITED
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NIHON GARTER CO;LTD.
|
2015-07-31
|
JAPAN
|
1.00 SET
|
2
|
SEMI CONDUCTOR MANUFACTURING EQUIPMENT SINGULATION LEAD CUTTING/FORMING MACHINE MODEL NO:NUZ-0003(NET WT:450 KGS)
|
HINDUSTAN SEMICONDUCTORS LIMITED
|
NIHON GARTER CO;LTD.
|
2015-07-31
|
JAPAN
|
1.00 SET
|
3
|
SEMI CONDUCTOR MANUFACTURING EQUIPMENT DIE FOR SINGULATION LEAD CUTTING/FORMING MACHINE OF MODEL NO:NUZ-0003 FOR 2835 TY
|
HINDUSTAN SEMICONDUCTORS LIMITED
|
NIHON GARTER CO;LTD.
|
2015-07-31
|
JAPAN
|
1.00 SET
|
4
|
SEMI CONDUCTOR MANUFACTURING EQUIPMENT DIE FOR SINGULATION LEAD CUTTING/FORMING MACHINE OF MODEL NO:NUZ-0003 FOR 2835 TY
|
HINDUSTAN SEMICONDUCTORS LIMITED
|
NIHON GARTER CO;LTD.
|
2015-07-31
|
JAPAN
|
1.00 SET
|
5
|
SEMICONDUCTOR MANUFACTURING EQUIPMENT CANON MACHINERY DIE BONDER LED APPLICATION DIE BONDER CANON BESTEM-D10SP WITH STAN
|
HINDUSTAN SEMICONDUCTORS LIMITED
|
KANEMATSU CORPORATION
|
2015-07-31
|
MALAYSIA
|
1.00 SET
|
6
|
ENCAPSULATION EQUIPMENT FOR ASSEMBLY OF SEMICONDUCTOR MANUFACTURING DISPENSER SYSTEM MUSASHI TAD1000S
|
HINDUSTAN SEMICONDUCTORS LIMITED
|
KANEMATSU CORPORATION
|
2015-07-31
|
JAPAN
|
1.00 SET
|
7
|
WIRE BONDER FOR ASSEMBLY OF SEMICONDUCTOR DEVICE(LED) -MODELCONNX-LED PLUS CL53272-1349741
|
HINDUSTAN SEMICONDUCTORS LIMITED
|
N/A
|
2015-07-16
|
SINGAPORE
|
1.00 SET
|
8
|
SEMICONDUCTOR MANUFACTURING EQUIPMENTS TAPPING MACHINE NCT-2710 SZ
|
HINDUSTAN SEMICONDUCTORS LIMITED
|
NIHON GARTER CO;LTD.
|
2015-05-22
|
CHINA
|
1.00 SET
|
9
|
SEMICONDUCTOR MANUFACTURING EQUIPMENTS CHANGE KIT FOR NCS-3110IVSZ FOR 2835 TYPE
|
HINDUSTAN SEMICONDUCTORS LIMITED
|
NIHON GARTER CO;LTD.
|
2015-05-22
|
CHINA
|
1.00 SET
|
10
|
SEMICONDUCTOR MANUFACTURING EQUIPMENTS SORTING MACHINE NCS-3110IVSZ
|
HINDUSTAN SEMICONDUCTORS LIMITED
|
NIHON GARTER CO;LTD.
|
2015-05-22
|
CHINA
|
1.00 SET
|