1
|
EPOXY TYPE EMG-250-M 18MM*10.5G P/No. A2570 EPOXY MOLDING COMPOUND
|
CDIL SEMICONDUCTORS PRIVATE LIMITED
|
SHANGHAI LEGEND TRADING CO. LTD
|
2025-06-06
|
CHINA
|
885 KGS
|
2
|
RUBBER SHEET WAX W80-H, 230*10*8 MM , 17 GM /SHEET, M-09-004 P/N. A2547RUBBER SHEET
|
CDIL SEMICONDUCTORS PRIVATE LIMITED
|
YANGZHOU HY TECHNOLOGY DEVELOPMENT
|
2025-02-18
|
CHINA
|
40 KGS
|
3
|
RUBBER SHEET CLEAN C60-U, 230*10*8 MM, 17 GM/SHEET , M-09-003 P/N. A2546RUBBER SHEET
|
CDIL SEMICONDUCTORS PRIVATE LIMITED
|
YANGZHOU HY TECHNOLOGY DEVELOPMENT
|
2025-02-18
|
CHINA
|
70 KGS
|
4
|
EPOXY MOLDING COMPOUND EMG-250-M, 18MM x 10.5G, G-01-015 P/N. A2570EPOXY MOLDING COMPOUND
|
CDIL SEMICONDUCTORS PRIVATE LIMITED
|
YANGZHOU HY TECHNOLOGY DEVELOPMENT
|
2025-02-18
|
CHINA
|
1755 KGS
|
5
|
DLC-7546R3-1800 (S/N. DL-C150024) YOM:12/2015 USED MACHINEFOR CLEANING OF SEMICONDUCTOR DEVICES BY ULTRASONIC PROCES
|
CDIL SEMICONDUCTORS PRIVATE LIMITED
|
YANGZHOU HY TECHNOLOGY DEVELOPMENT CO. LTD.
|
2024-11-30
|
CHINA
|
1.00 UNT
|
6
|
JAF-300 (S/N. SOLM22) YOM:03/2017 USED DIE ATTACH APPARATUS/DIE BONDER FOR ASSEMBLY OF SEMICONDUCTOR DEVICES
|
CDIL SEMICONDUCTORS PRIVATE LIMITED
|
YANGZHOU HY TECHNOLOGY DEVELOPMENT CO. LTD.
|
2024-11-30
|
CHINA
|
1.00 UNT
|
7
|
JAF-300 PLUS (S/N. SOLM1901) YOM:08/2019 USED DIE ATTACH APPARATUS/DIE BONDER FOR ASSEMBLY OF SEMICONDUCTOR DEVICES
|
CDIL SEMICONDUCTORS PRIVATE LIMITED
|
YANGZHOU HY TECHNOLOGY DEVELOPMENT CO. LTD.
|
2024-11-30
|
CHINA
|
1.00 UNT
|
8
|
MKE (S/N. A22-03-31) YOM:03/2022 USED DIE ATTACH APPARATUSFOR ASSEMBLY OF SEMI-CONDUCTORS
|
CDIL SEMICONDUCTORS PRIVATE LIMITED
|
YANGZHOU HY TECHNOLOGY DEVELOPMENT CO. LTD.
|
2024-11-30
|
CHINA
|
1.00 UNT
|
9
|
MKE (S/N. A24-09HY) YOM:09/2024 DIE ATTACH APPARATUS FOR ASSEMBLY OF SEMICONDUCTOR DEVICES
|
CDIL SEMICONDUCTORS PRIVATE LIMITED
|
YANGZHOU HY TECHNOLOGY DEVELOPMENT CO. LTD.
|
2024-11-30
|
CHINA
|
1.00 UNT
|
10
|
PF-TL2 (S/N. TL217050002) YOM:05/2017 USED WIRE BONDER FORASSEMBLY OF SEMICONDUCTOR DEVICES
|
CDIL SEMICONDUCTORS PRIVATE LIMITED
|
YANGZHOU HY TECHNOLOGY DEVELOPMENT CO. LTD.
|
2024-11-30
|
CHINA
|
1.00 UNT
|