1
|
MAEU249874776
|
RESIN ABS PC 2 0103-003108 RESIN ABS PC 2 0103-003108 RESIN ABS PC 2 0103-003108 RESIN ABS PC 2 0103-003108 RESIN ABS PC 2 0103-00310 8 RESIN ABS PC 2 0103-0031 08 RESIN ABS PC 2 0103-003, 108 RESIN ABS PC 2 0103-00 3108
|
SAMSUNG ELECTRONICS POLAND
|
SAMSUNG ELECTRONICS DIGITAL APPLI
|
2025-02-21
|
Mexico
|
20267 Kgs
|
15 PKG
|
2
|
MAEU246323860
|
RESIN ABS PC 10 0103-003108
|
SAMSUNG ELECTRONICS POLAND
|
SAMSUNG ELECTRONICS DIGITAL APPLI
|
2024-12-03
|
Mexico
|
16234 Kgs
|
10 PKG
|
3
|
CMDUMXO0474880
|
FREIGHT PREPAID 0103-011107 RESIN GPPS G-116HV/U5680,TP GRAY,GY0326
|
SAMSUNG ELECTRONICS POLAND
|
SAMSUNG ELECTRONICS POLAND
|
2020-03-06
|
Mexico
|
20116 Kgs
|
640 PCS
|
4
|
CMDUMXO0461399
|
------------ BEAU2791063 DESCRIPTION---------RESIN // HS CODE 390319 -------------GENERIC DESCRIPTION-------------FREIGHT PREPAID
|
SAMSUNG ELECTRONICS POLAND
|
SAMSUNG ELECTRONICS DIGITAL
|
2019-09-21
|
Mexico
|
9296 Kgs
|
9 PCS
|
5
|
OOLU260534722006
|
INJECTION MOLDS
|
SAMSUNG ELECTRONICS POLAND
|
SAMSUNG ELECTRONICS DIGITAL APPLIAN
|
2018-06-15
|
Mexico
|
350 Kgs
|
1 BLK
|
6
|
CMDUMX1400458
|
------------ TEMU4100718 DESCRIPTION---------5 PACKAGES WITH RESIN SAN HF 5661 NTR,NC0001. 5 PACKAGES WITH RESIN-ABS QSD-0160,COOL WHITE WT0057,HB. 2 PACKAGES WITH RESIN-PC
|
SAMSUNG ELECTRONICS POLAND
|
SAMSUNG ELECTRONICS DIGITAL
|
2014-01-24
|
Mexico
|
9880 Kgs
|
12 PCS
|
7
|
OOLU253593074003
|
RESIN ABS
|
SAMSUNG ELECTRONICS POLAND
|
SAMSUNG ELECTRONICS MEXICO
|
2013-08-20
|
Mexico
|
800 Kgs
|
1 PKG
|
8
|
HLCUME3130519924
|
RESIN RESIN-PP RM60 BLACK BK0001
|
SAMSUNG ELECTRONICS POLAND
|
SAMSUNG ELECTRONICS MEXICO S.A. DE
|
2013-05-21
|
Mexico
|
78000 Kgs
|
120 PCS
|
9
|
HLCUME3130511447
|
RESIN-PP RM60 BLACK BK0001
|
SAMSUNG ELECTRONICS POLAND
|
SAMSUNG ELECTRONICS MEXICO S.A. DE
|
2013-05-14
|
Mexico
|
52000 Kgs
|
80 PCS
|
10
|
HLCUME3130437141
|
RESIN-PP RM60 BLACK BK0001
|
SAMSUNG ELECTRONICS POLAND
|
SAMSUNG ELECTRONICS MEXICO S.A. DE
|
2013-04-29
|
Mexico
|
78000 Kgs
|
120 PCS
|