1
|
NPNETYOAKD19816
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE
|
DISCO HI-TECH AMERICA,INC.
|
DISCO, INC
|
2019-09-24
|
Japan
|
1925 Kgs
|
4 CTN
|
2
|
YUGLYLKS9028409
|
FULLY AUTOMATICDICING SAW HS CODE:848610 2CARTONS
|
DISCO HI-TECH AMERICA, INC.
|
DISCO, INC
|
2019-06-09
|
China
|
694 Kgs
|
2 CTN
|
3
|
NPNETYOAGA89460
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE
|
DISCO HI-TECH AMERICA,INC.
|
DISCO, INC
|
2019-02-19
|
Japan
|
1950 Kgs
|
3 CTN
|
4
|
NPNETYOAGA43772
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE
|
DISCO HI-TECH AMERICA,INC.
|
DISCO, INC
|
2019-02-19
|
Japan
|
1283 Kgs
|
1 CTN
|
5
|
NPNETYOADX99661
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE
|
DISCO HI-TECH AMERICA,INC.
|
N/A
|
2018-09-04
|
Japan
|
743 Kgs
|
2 CTN
|
6
|
NPNETYOADV33451
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE
|
DISCO HI-TECH AMERICA,INC.
|
N/A
|
2018-08-30
|
Japan
|
2000 Kgs
|
4 CTN
|
7
|
PWTDG000023527OE
|
USED AUTOMATIC DICING SAW MACHINE
|
DISCO HI-TECH AMERICA INC
|
DISCO HI-TEC (SINGAPORE) PTE LTD
|
2018-08-30
|
Singapore
|
610 Kgs
|
3 CAS
|
8
|
NPNETYOADV62534
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE
|
DISCO HI-TECH AMERICA,INC.
|
N/A
|
2018-08-26
|
Japan
|
1333 Kgs
|
2 CTN
|
9
|
NPNETYOADM32661
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE
|
DISCO HI-TECH AMERICA,INC.
|
N/A
|
2018-08-12
|
Japan
|
1361 Kgs
|
2 CTN
|
10
|
NPNETYOADM32602
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE
|
DISCO HI-TECH AMERICA,INC.
|
N/A
|
2018-08-12
|
Japan
|
1348 Kgs
|
3 CTN
|