1
|
GOLA616911389600
|
CAR PARTS
|
CYPRESS SEMICONDUCTOR
|
PAWEL MIKINKA MIKINKA PROJEKT COM
|
2025-06-28
|
Poland
|
100 Kgs
|
2 PLT
|
2
|
PSLAP21059146AST
|
KLA / TENCOR 8100XP CIRTICAL DIMENSION SCANNING ELECTRON MICROSCOPE (CD-SEM) HS CODE:9031.41 AMS#PSLAP21059146AST
|
CYPRESS SEMICONDUCTOR
|
CAPITAL ASSET EXCHANGE
|
2021-06-25
|
China Taiwan
|
1856 Kgs
|
2 WDC
|
3
|
BANQSEL6910885
|
INDUSTRIAL MASK ANTIDUST SHEET INVOICE #ECO2021011802 PO#2100035492 HS-CODE 630790
|
CYPRESS SEMICONDUCTOR CORPORATION
|
ECO TECH INTERNATIONAL LTD.
|
2021-02-17
|
South Korea
|
278 Kgs
|
75 PKG
|
4
|
BANQSEL6902887
|
RUBBER GLOVES HS CODE 401519 CYPRESS PO# 2100034232 DISPOSAL WHITE NITRILE GLOVES
|
CYPRESS SEMICONDUCTOR CORPORATION
|
SEOUL SEMICONDUCTOR CO., LTD
|
2020-12-06
|
South Korea
|
1730 Kgs
|
176 PKG
|
5
|
DMALS2002619276
|
AMC FILTERS
|
CYPRESS SEMICONDUCTOR CORP
|
EXYTE TECHNOLOGY GMBH
|
2020-11-12
|
Germany
|
5350 Kgs
|
10 PKG
|
6
|
ORLCNNR191000142
|
DICE IN WAFER FORM HS CODE: 8542.39 SKELETON WAFER HS CODE: 8542.39
|
CYPRESS SEMICONDUCTOR
|
ADVANCED SEMICONDUCTOR ENGINEERING
|
2019-10-27
|
China Taiwan
|
320 Kgs
|
26 CTN
|
7
|
ORLCNNR190700165
|
DICE IN WAFER FORM HS CODE: 8542.39 DICE IN WAFER FORM HS CODE: 8542.39 DICE IN WAFER FORM HS CODE: 8542.39
|
CYPRESS SEMICONDUCTOR
|
ADVANCED SEMICONDUCTOR ENGINEERING
|
2019-07-28
|
China Taiwan
|
51 Kgs
|
16 CTN
|
8
|
ORLCNNR190500014
|
DICE IN WAFER FORM HS CODE: 8542.39.00 SKELETON WAFER HS CODE: 8542.39.00
|
CYPRESS SEMICONDUCTOR
|
ADVANCED SEMICONDUCTOR ENGINEERING
|
2019-05-19
|
China Taiwan
|
321 Kgs
|
35 CTN
|
9
|
ORLCNNR190200101
|
MATERIAL TYPE CYPRESS HS CODE: 8542.39.00 DIEC IN WAFER FORM HS CODE: 8542.39.00 SKELETON WAFER HS CODE: 8542.39.00
|
CYPRESS SEMICONDUCTOR
|
ADVANCED SEMICONDUCTOR ENGINEERING
|
2019-03-02
|
China Taiwan
|
280 Kgs
|
35 CTN
|
10
|
ORLCNNR180700095
|
MATERIAL TYPE DEVICE DICE IN WAFER FORM SKELETON WAFER
|
CYPRESS SEMICONDUCTOR
|
ADVANCED SEMICONDUCTOR ENGINEERING
|
2018-07-21
|
China Taiwan
|
344 Kgs
|
35 CTN
|