1
|
EXDO6911625385
|
HEAT SINK HTS:
|
BENCHMARK ELECTRONICS PHOENIX INC.
|
GENESIS TECHNOLOGY USA INC
|
2025-09-03
|
Hong Kong
|
130 Kgs
|
8 CTN
|
2
|
EXDO6911617041
|
CONNECTOR HTS:
|
BENCHMARK ELECTRONICS PHOENIX INC.
|
CONNTECH INTERNATIONAL LIMITED
|
2025-05-18
|
Hong Kong
|
101 Kgs
|
9 CTN
|
3
|
EXDO6911615805
|
MULTILAYER CHIP CAPACITOR HTS:
|
BENCHMARK ELECTRONICS PHOENIX INC.
|
WALSIN TECHNOLOGY CORPORATION
|
2025-04-25
|
Hong Kong
|
91 Kgs
|
16 CTN
|
4
|
EXDO6911614744
|
HEAT SINK HTS:
|
BENCHMARK ELECTRONICS PHOENIX INC.
|
GENESIS TECHNOLOGY USA INC
|
2025-04-21
|
Hong Kong
|
115 Kgs
|
7 CTN
|
5
|
EXDO6911614390
|
CONNECTOR HTS:
|
BENCHMARK ELECTRONICS PHOENIX INC.
|
CONNTECH INTERNATIONAL LIMITED
|
2025-04-04
|
Hong Kong
|
79 Kgs
|
7 CTN
|
6
|
EXDO6911611695
|
CONNECTOR HTS:
|
BENCHMARK ELECTRONICS PHOENIX INC.
|
CONNTECH INTERNATIONAL LIMITED
|
2025-03-07
|
Hong Kong
|
440 Kgs
|
35 CTN
|
7
|
EXDO6911610018
|
CONNECTOR HTS:
|
BENCHMARK ELECTRONICS PHOENIX INC.
|
CONNTECH INTERNATIONAL LIMITED
|
2025-01-27
|
Hong Kong
|
33 Kgs
|
4 CTN
|
8
|
EXDO6911609332
|
MULTILAYER CHIP CAPACITOR HTS:
|
BENCHMARK ELECTRONICS PHOENIX INC.
|
WALSIN TECHNOLOGY CORPORATION
|
2025-01-18
|
Hong Kong
|
113 Kgs
|
19 CTN
|
9
|
EXDO6911607346
|
CONNECTOR HTS:
|
BENCHMARK ELECTRONICS PHOENIX INC.
|
CONNTECH INTERNATIONAL LIMITED
|
2025-01-03
|
Hong Kong
|
147 Kgs
|
13 CTN
|
10
|
EXDO6911607722
|
MULTILAYER CHIP CAPACITOR HTS:
|
BENCHMARK ELECTRONICS PHOENIX INC.
|
WALSIN TECHNOLOGY CORPORATION
|
2025-01-03
|
Hong Kong
|
97 Kgs
|
14 CTN
|