1
|
BWLEHKG58641113
|
PRINTED CIRCUIT BOARDTHIS SHIPMENT DOES NOT CONTAIN ANY WOODPACKING MATERIALS
|
AMPHENOL OPTIMIZE FTZ INBOND C/O TE
|
SUNTAK TECHNOLOGY LTD.
|
2025-05-18
|
Hong Kong
|
179 Kgs
|
19 CTN
|
2
|
BWLEHKG58571027
|
17CTNS PACKED INTO 1PLTCONNECTOR INVOICE# 2025IVAC012613 PO# M000087 THIS SHIPMENT DOES NOT CONTAIN ANY WOODPACKING MATERIALS
|
AMPHENOL OPTIMIZE FTZ INBOND C/O TE
|
AMPHENOL EAST ASIA LTD
|
2025-04-29
|
Hong Kong
|
249 Kgs
|
17 CTN
|
3
|
BWLEHKG58531707
|
(102CTNS PACKED INTO 3PLTS)+12CTNS
|
AMPHENOL OPTIMIZE FTZ INBOND C/O TE
|
ADVANCED CONNECTION TECHNOLOGY INC
|
2025-04-21
|
Hong Kong
|
837 Kgs
|
114 CTN
|
4
|
BWLEHKG58537471
|
54CTNS PACKED INTO 1PLTPRINTED CIRCUIT BOARDTHIS SHIPMENT DOES NOT CONTAIN ANY WOODPACKING MATERIALS
|
AMPHENOL OPTIMIZE FTZ INBOND C/O TE
|
SUNTAK TECHNOLOGY LTD.
|
2025-04-21
|
Hong Kong
|
519 Kgs
|
54 CTN
|
5
|
BWLEHKG58531724
|
52CTNS PACKED INTO 1PLTPRINTED CIRCUITS BOARDSTHIS SHIPMENT DOES NOT CONTAIN ANY WOODPACKING MATERIALS
|
AMPHENOL OPTIMIZE FTZ INBOND C/O TE
|
KUNSHAN HUATAO ELECTRONICS CO.,LTD
|
2025-04-21
|
Hong Kong
|
657 Kgs
|
52 CTN
|
6
|
BWLEHKG58531718
|
72CTNS PACKED INTO 4PLTSMEATL EMI FRAME/METAL EMI COVER 73201020 M000012THIS SHIPMENT DOES NOT CONTAIN ANY WOODPACKING MATERIALS
|
AMPHENOL OPTIMIZE FTZ INBOND C/O TE
|
KUNSHAN YUKAI HARDWARE SPRING CO.,L
|
2025-04-21
|
Hong Kong
|
642 Kgs
|
72 CTN
|