1
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ZSAJSE202505043
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TEL ETCHER
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AVP TECHNOLOGY, LLC
|
N/A
|
2025-06-15
|
China Taiwan
|
4170 Kgs
|
5 BOX
|
2
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HLCUHAMOF24315AA
|
MULTIPLEX CLUSTER SYSTEM, STS / CPX MULTIPLEX CLUSTER SYSTEM, 4-6 PROCESS BOSCH ICP CHAMBER (2) HLCUHAMOF24315AA
|
AVP TECHNOLOGY LLC
|
CAE C/O LOGISTICS PLUS DEUTSCHLAND
|
2024-07-27
|
Germany
|
4442 Kgs
|
8 PCS
|
3
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JAPTENGO23060157
|
OTHER MACHINES FOR THE MANUFACTURE OF SEMICONDUCTOR DEVICES OR ICS NES
|
AVP TECHNOLOGY, LLC
|
TKS CORP.
|
2023-07-01
|
Japan
|
26870 Kgs
|
49 CAS
|
4
|
HLCULE1MBAQPW1AA
|
ELECTRIC CLOSETS AND ACCESSORIES SPTS / STS / TRIKON PLANAR 300 PECVD SYSTEM, 12,(2) DELTA APM PECVD CHAMBERS,RPS FOR SIN AND SIO DEPOSITION,APM PLASMA
|
AVP TECHNOLOGY LLC
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COMMISSARIAT A L'ENERGIE ATOMIQUE
|
2022-05-25
|
France
|
5217 Kgs
|
5 PCS
|
5
|
JAPTENGO20080386
|
OTHER MACHINES FOR THE MANUFACTURE OF SEMICONDUCTOR DEVICES OR ICS NES
|
AVP TECHNOLOGY,LLC.
|
TKSLLC
|
2020-09-16
|
Japan
|
18400 Kgs
|
16 CAS
|
6
|
AOLTHKG17120090
|
CENTRAL WAFER HANDLER AND ACCESSORIES
|
AVP TECHNOLOGY LLC
|
SAE MAGNETICS (H.K.) LTD.
|
2018-01-02
|
Hong Kong
|
2945 Kgs
|
5 PKG
|
7
|
KWEO122043403713
|
USED SEMICONDUCTOR MANUFACTURING EQUIPMENT (NEXSUS IBE-350 C2 SYSTEM) (8486.20)
|
AVP TECHNOLOGY LLC
|
TKSLLC
|
2017-07-02
|
China Taiwan
|
6080 Kgs
|
5 CAS
|
8
|
KWEO122042851590
|
MULTI TARGET PVD SYSTEM (8486.20)
|
AVP TECHNOLOGY LLC
|
TKSLLC
|
2016-12-11
|
China Taiwan
|
18850 Kgs
|
16 CAS
|
9
|
KWEO122042851494
|
VACUUM OVEN (8486.20)
|
AVP TECHNOLOGY LLC
|
TKSLLC
|
2016-11-20
|
China Taiwan
|
29600 Kgs
|
14 CAS
|
10
|
MOLUH2000365836
|
12 CRT MACHINES APPARATUS FOR THE MANUFACTURE OF BOULES OR WAFERS HS CODE 84 86 100000
|
AVP TECHNOLOGY LLC
|
N/A
|
2016-09-22
|
United Kingdom
|
13856 Kgs
|
12 CRT
|